R&D Engineer, Thin Film Solution Processing

About the role

We are seeking a skilled individual to join our R&D laboratory team. The successful candidate will work closely with engineers and technicians to develop and execute thin-film solution deposition processes, particularly focusing on the operation and development of the nScrypt Last Step Interconnection (LSI) tool.

Responsibilities

• Operate and develop processes for the nScrypt Last Step Interconnection (LSI) tool, a critical step in module fabrication.
• Contribute to adjacent thin-film process development, including ongoing work on blanket thin-film encapsulation.
• Interface with colleagues across teams to develop and execute experimental plans that advance the performance and durability of our perovskite modules.

Requirements

• Work experience showing willingness to push projects forward and work as a team to accomplish goals.
• Experience in a scientific or engineering-related industry.
• Experience with solution processing of semiconductor thin films, especially microdispensing, screen printing, or inkjet printing.
• Hands-on laboratory experience.
• Able to take detailed and meticulous notes of processing conditions and observations.

Qualifications

• Comfort with uncertainty and flexibility to solve multifaceted problems.
• An interest in learning and pride in one's work.
• Effective communication skills to present findings and collaborate with team members.

Skills

• Microdispensing, screen printing, or inkjet printing experience.
• Experience with coating and curing processes, such as aerosol/spray coating or epoxy coating.

Benefits

We offer an awesome team of dedicated technologists changing the way the world is powered! Additional benefits include:

• Flexible PTO
• Healthcare coverage
• Life Insurance
• Long-term & Short-term Disability
• Parental leave
• Meaningful equity

Pay

Details TBD

Schedule

Details TBD