Quantum Packaging Thermal Architect

About the role

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon.

Primary Location: US, Oregon, Hillsboro

Responsibilities

• Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware
• Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders
• Work closely with mechanical designers to define heat spreaders for optimal performance
• Deliver and disseminate design milestones to stakeholders
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

Skills

• Excellent communication and presentation skills for technical and non-technical audiences
• Strong analytical thinking and problem-solving capabilities
• Collaborative mindset with ability to work effectively across diverse teams
• Adaptability to work in a fast-paced, innovative research environment
• Passion for pushing the boundaries of quantum technology development

Qualifications

Minimum Qualifications:

• M.S. degree in Electrical Engineering, Physics or related field AND 5+ years of experience in thermal modeling and simulation for packaging, or other related hardware. OR Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas.
• Experience with thermal/mechanical modeling, simulation, and optimization with simulation software such as Ansys Icepak, COMSOL, and related.
• Understanding of packaging technologies and thermal integration.

Preferred Qualifications:

• 2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Pay

Annual Salary Range for jobs which could be performed in the US: $141,910.00 - 200,340.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Schedule

This role requires an on-site presence.