Quantum IC Package Substrate Design Engineer

About the role

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Hillsboro, Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Responsibilities

• Design of IC substrates using Siemens Xpedition IC package design software
• Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers
• Deliver and disseminate design milestones to stakeholders
• Design validation and verification; including DRC and LVS
• Advanced packaging design integration (2.5D and 3D) with IC substrate
• Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

Qualifications

Minimum Qualifications:

• B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
• OR M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
• The Experience Must Include Siemens Xpedition design environment and workflow.
• High-speed signal routing.
• Experience with large form factor IC substrates.

Preferred Qualifications:

• 1+ years of experience with advanced routing engines for IC substrate design. Examples include AI and physics/model-based routing engines.
• Proficiency with understanding SI/PI/thermal impact on IC substrate design choices.

Benefits

• Competitive pay
• Stock bonuses
• Health benefits
• Retirement benefits
• Vacation

Pay

Annual Salary Range for jobs which could be performed in the US: $122,440.00 - 172,860.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

Shift 1 (United States of America). This role will require an on-site presence.