Professor of Empire Innovation, Microelectronics

Binghamton University is a premier public R1 research institution in the State University of New York (SUNY) system, offering over 130 interdisciplinary programs and vibrant research opportunities. Our mission emphasizes student success, research, and community engagement, fostering a collegial and inclusive environment for faculty, staff, and a diverse student body of 18,000+.

About the role

Binghamton University is seeking a well-established expert in Microelectronics for a tenured Full Professor position, titled Professor of Empire Innovation, supported by SUNY's Empire Innovation Program (EIP). This role focuses on advancing research and scholarship in strategic priority areas within microelectronics, leveraging Binghamton's leadership in microelectronic systems, semiconductors, and advanced packaging.

The Small Scale Systems Integration and Packaging (S3IP) center, a New York State Center of Excellence, houses specialized centers such as the Center for Heterogeneous Integration Research in Packaging (CHIRP), Center for Advanced Microelectronics Manufacturing (CAMM), and others. These centers drive sponsored research in advanced packaging, heterogeneous integration, semiconductor manufacturing, and sustainable microelectronics, with over $1.9 billion in economic impact for New York State since 1996 through collaborations with industry leaders like IBM, AMD, NVIDIA, and Intel.

Responsibilities

• Lead funded research and scholarship in one or more of the following areas:
  • Codesign for Heterogeneous Integration/Advanced Packaging: EDA tools for chiplet integration or system design, including applied AI/ML techniques, and modeling for co-design addressing chiplet system architecture, thermal/mechanical issues, materials, and reliability.
  • Digital Twinning for Semiconductor Manufacturing and Packaging (SMP): Process optimizations across lithography, device/chiplet fabrication, integration/assembly, material choices, and materials synthesis to improve manufacturing yield.
  • Semiconductor Lifecycle Impact Reduction: Sustainable microelectronics manufacturing through eco-friendly materials, reduced hazardous chemicals (e.g., PFAS), energy-efficient processes, circular economy models, lifecycle assessment tools, and end-of-life waste management.
• Secure funding from federal/state agencies and industry partners, pursuing large-scale opportunities and enhancing collaborative research across campus units.
• Recruit and attract top talent to complement existing strengths in microelectronics and related fields.
• Contribute to education and mentorship at the undergraduate and graduate levels.

Requirements

• A doctoral degree in Engineering, Computer Science, or a closely related discipline.
• Proven record of research leadership in cross-cutting, multi-institutional collaborative teams.
• Established track record of securing sponsored research funding from federal and state agencies.
• History of peer-reviewed, high-impact publications.
• Experience as an educator and research mentor at the undergraduate and/or graduate level.

Preferred Qualifications

• Significant scholarly contributions in one or more focus areas: Codesign for Heterogeneous Integration/Advanced Packaging, Digital Twinning for Semiconductor Manufacturing and Packaging, or Semiconductor Lifecycle Impact Reduction.
• Potential to lead multi-disciplinary research in Microelectronics across departments and schools within the Watson College of Engineering and Applied Science.

Benefits

• Comprehensive startup package, including competitive salary and benefits.

Depending on specialization, the successful candidate may be appointed as tenured faculty in the Electrical and Computer Engineering (ECE) Department, Mechanical Engineering (ME) Department, School of Computing (CS), or School of System Science and Industrial Engineering (SSIE).