Process Integration, Yield and Defect Reduction Engineering Lead

About the role

The New Mexico Silicon Manufacturing (NM Si Manufacturing) Integration Team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration (PI) Team Lead role. This position reports directly to the Integration Director and offers the opportunity to lead teams of technical contributors supporting Intel's advanced packaging manufacturing operations.

In this role, you will collaborate closely with Advanced Packaging High-Volume Manufacturing (HVM) engineering and factory operations teams to support the transfer, ramp, and sustainment of advanced packaging technologies. You will play a critical role in ensuring successful execution against foundry customer commitments while driving continuous improvements in yield, quality, reliability, and manufacturing efficiency. The ideal candidate will have a proven track record of technical leadership, innovation, and cross-functional collaboration. Success requires strong problem-solving skills, the ability to influence across organizations, and a passion for enabling technology development in a high-volume manufacturing environment.

Responsibilities

• Lead teams of technical contributors in advanced packaging manufacturing operations.
• Support the transfer, ramp, and sustainment of advanced packaging technologies.
• Ensure successful execution against foundry customer commitments.
• Drive continuous improvements in yield, quality, reliability, and manufacturing efficiency.
• Analyze defectivity and parametric data to identify yield limiters and drive process improvements.
• Develop inline monitoring systems, dashboards, and manufacturing health metrics.
• Apply Failure Modes and Effects Analysis (FMEA) techniques.
• Lead cross-functional teams and influence technical decisions across multiple organizations.
• Drive operational excellence, yield improvement, and manufacturing efficiency initiatives.

Requirements

Minimum Qualifications:

• Bachelor's or Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Materials Science, Microelectronics Engineering, Chemistry, Physics, or a related technical field.
• 5+ years of experience in semiconductor manufacturing or advanced packaging.
• Experience in one or more of the following areas:
  • 5+ years of experience in process integration or defect reduction for backend interconnect or advanced packaging processes.
  • 3+ years of experience applying Design of Experiments (DOE) methodologies.
  • 5+ years of experience in data analysis and statistical process control using tools such as JMP, SQL, PCS, or similar platforms.

Preferred Qualifications

• Strong understanding of semiconductor manufacturing process flow and advanced packaging technologies.
• Knowledge of process capability analysis, specification management, statistical variation, and process control methodologies.
• Proven ability to analyze defectivity and parametric data to identify yield limiters and drive process improvements.
• Experience with yield analysis and defect reduction methodologies.
• Experience developing inline monitoring systems, dashboards, and manufacturing health metrics.
• Demonstrated success leading technology development, transfer, and manufacturing ramp activities.
• Strong project management, communication, and stakeholder management skills.
• Ability to solve complex technical challenges using innovative and data-driven approaches.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $140,830.00 - $198,820.00 USD. The range reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America).

Primary location: US, New Mexico, Albuquerque.