Process Integration, Yield and Defect Reduction Engineering Manager

About the role

The New Mexico Silicon Manufacturing Integration team is seeking a highly motivated engineering professional with a strong technical background to grow into a Process Integration, Yield, and Defect Reduction Engineering Manager role.

Role and Impact

As part of the Manufacturing Integration team, you will drive process integration, yield improvement, and defect reduction initiatives that enable high-quality, high-volume manufacturing of advanced packaging technologies. You will partner across engineering organizations to identify manufacturing challenges, implement data-driven solutions, and develop scalable manufacturing processes that improve product quality, reliability, and yield.

Key Responsibilities

• Develop and execute a comprehensive defect reduction roadmap to improve yield and product quality.

• Leverage Win It Inline methodologies to drive continuous process improvement while meeting quality and reliability objectives.

• Lead a team of process integration, yield, and defect reduction engineers in solving complex manufacturing challenges.

• Collaborate with design, materials, product engineering, characterization, process development, and High Volume Manufacturing (HVM) teams to optimize manufacturing performance.

• Build and maintain inline metrics dashboards for critical process modules and manufacturing parameters.

Behavioral Skills

• High level of technical contributions with a proven history of technology development, technical problem solving, and technology transfer through the creation of innovative solutions that demonstrate creativity and out-of-the-box thinking.

• Ability to work effectively across organizational boundaries, including Process Engineering, Yield Engineering, and Product Engineering.

• Excellent written and verbal communication skills.

• Strong stakeholder management and interpersonal skills.

• Demonstrated ability to lead and influence others without formal authority.

• Ability to think and operate independently while effectively managing multiple competing priorities.

Qualifications

• Minimum Qualifications: Master's or PhD in Electrical Engineering, Materials Science, Physics, Chemistry, Chemical Engineering, or a related technical discipline. 5+ years of relevant semiconductor manufacturing or advanced packaging experience.

• Demonstrated track record of: Technology development and technology transfer. Solving complex technical problems through innovative engineering approaches. High levels of technical contribution throughout the product development lifecycle.

Preferred Qualifications

• Experience with the following: 3+ years of yield analysis and defect reduction methodologies. 3+ years of Failure Mode and Effects Analysis (FMEA). 3+ years developing inline monitoring systems and manufacturing dashboards. Deep understanding of integrated semiconductor process flows and process interactions. Strong knowledge of defect metrology tools and capabilities.