Principal Packaging Engineer

Key Responsibilities

• Select and design optimal multi-die package types (MCM, 2.5D, 3D, fan-out, CoWoS, InFO, CPC, CPO) balancing electrical performance, thermal behavior, cost, and manufacturability.
• Define package specifications, bump map and ball map, interposer requirements, and mechanical constraints.
• Define substrate stack-ups, bump pitch, ball pitch, routing, via structures, and material choices for performance and manufacturability.
• Perform high-speed signal escaping, routing and power distribution network design.
• Manage subcontractors and work directly with TSMC and/or OSAT on bumping, substrate options, and advanced packaging flows.
• Partner with IC design, physical design, SI/PI, and board teams to ensure package requirements meet system-level needs.
• Evaluate emerging packaging technologies and drive adoption for next-generation products.
• Support package-level bring-up, failure analysis, debug and qualification.

Required Skills & Qualifications

• B.S./M.S. in Electrical Engineering or related field.
• Experience with multi-die package design and UCIe (AP/SP) integration.
• Understanding of substrate materials, stack-ups, and mechanical constraints.
• Familiarity with SI/PI concepts to collaborate effectively with electrical teams.
• Experience managing packaging subcontractors.
• Experience interfacing with TSMC/OSAT for bumping and packaging options.
• Knowledge of package modeling tools (HFSS, Sigrity, or similar) is a plus.

Pay

Compensation Target base salary for this role is $180,000–$240,000 per year + meaningful equity + benefits + 401k. Our salary ranges are determined by role, level, experience, and location.

Schedule

N/A

Benefits

N/A

Agency Note

We do not accept resumes from agencies or search firms. Please do not forward candidate profiles through our careers page, email, LinkedIn messages, or directly to company employees. Any resumes submitted will be deemed the property of the company, and no fees will be paid in the event the candidate is hired.