Principal Engineer – Multi-Physics Sign-off (Timing, PDN & Thermal)

Responsibilities

This is a hand-on role for delivering tool-flow-methodology and automation.

• Develop, maintain, and qualify CAD flows for 3DIC and 2.5D designs, including chiplets, interposers, and advanced packaging technologies.
• Enable end-to-end implementation and signoff methodologies covering floor planning through tapeout.
• Support die-to-die connectivity, bump/TSV-aware flows, and cross-die constraint management.
• Work with design and packaging teams to integrate package-aware and system-aware considerations into PD flows.
• Develop and support STA methodologies for multi-die designs, including cross-die timing, constraints, and closure strategies.
• Enable power analysis, IR drop, and EM signoff flows for 2.5D and 3DIC systems.
• Define guidelines for ESD verification in advanced packaging contexts.
• Aid with tool qualification, correlation, and signoff criteria definition.
• Develop and support thermal analysis methodologies for 3DIC and 2.5D designs.
• Enable CFD/FEM-based thermal analysis to model conduction, convection, and airflow effects from die to package to system.
• Support coupled electro-thermal and Multiphysics flows, integrating power, thermal, and reliability analysis.
• Partner with design and package teams to incorporate thermal considerations early in the design flow.
• Build and maintain automation, scripts, and checks to improve flow robustness, runtime, and usability.
• Develop documentation, examples, and training materials for design teams.
• Debug flow issues and provide CAD support during active design cycles.
• Drive continuous improvement based on user feedback and silicon takeaways.

Requirements

VLSI Knowledge MUST Minimum 5+ years of System Level experience Strong hands-on experience with 3DIC and/or 2.5D designs Familiarity with chiplet-based designs, system-in-package designs and tradeoffs involved

• Experience with TSVs, micro-bumps, interposers, and advanced packaging technologies.
• Familiarity with industry-standard EDA tools for 3DIC implementation and signoff.
• Cadence Integrity 3D-IC
• Synopsys 3DIC Compiler
• Cadence Celsius Thermal Solver
• Ansys Icepak
• Ansys RHSC-ET

Qualifications

Nice to have

• Experience with TSVs, micro-bumps, interposers, and advanced packaging technologies.
• Familiarity with industry-standard EDA tools for 3DIC implementation and signoff.