Jobs · Engineering

Principal Thermal & Multiphysics Engineer

TE Connectivity · United States · 2 wk ago
RemoteRemoteEngineering$154k–$231k/yrFull-time

Main Responsibilities

  • Strategy & Architecture
    • Lead end-to-end multiphysics simulation strategy and method development for thermal performance of complex electro-mechanical systems (connectors, high-speed I/O, enclosures, power-dense assemblies)
    • Support thermal architecture development, defining heat transfer strategies across conduction, convection, and radiation to meet system-level performance targets
    • Influence product and technology strategy, contributing to roadmaps in data centers, high-speed interconnects, and power delivery systems
  • Simulation Method Development & Support on Design Execution
    • Translate system-level thermal challenges into physics-based models using FEA/CFD to solve electro-thermal, thermo-mechanical, and fluid-thermal problems under real-world conditions
    • Drive thermal design optimization for high-power-density systems, balancing temperature, pressure drop, signal integrity, and manufacturability
    • Support material and interface strategies (TIMs, high-conductivity alloys, advanced polymers/composites) to ensure performance and reliability under thermal cycling, aging, and environmental stress
    • Establish thermal design standards and best practices, including thermal resistance networks, contact/interface heat transfer, airflow and liquid cooling integration, and thermal distortion/tolerance stack-up effects
    • Standardize methodologies and scalable models to enable reusable simulation frameworks, digital twins, and cross-platform design libraries
    • Support innovation in next-generation cooling solutions, including liquid cooling, co-packaged optics integration, high-current connector thermal management, and AI-driven optimization
  • Cross-Functional Integration
    • Collaborate with electrical (SI/PI), mechanical, and manufacturing teams to co-optimize system performance, packaging density, and thermal solutions
  • Validation & Governance
    • Lead thermal model validation and correlation through lab testing (IR thermography, thermocouples, wind tunnel), model calibration, and development of design margins and derating guidelines
    • Support design governance and technical reviews (DFMEA, PFMEA), ensuring robust multiphysics considerations in product decisions
  • Leadership & External Engagement
    • Mentor engineers and build domain expertise in thermal sciences, multiphysics simulation, and physics-based design
    • Represent the organization externally with customers, industry forums, and standards bodies on advanced thermal challenges

Required Skills/Experience

  • Bachelor’s degree in Mechanical Engineering or Physics with 12+ years of experience, or Master's with 10+ years of experience, or PhD with 6+ years of experience, or equivalent amount of experience in mechanical product development in connector, electronics, or high-reliability hardware industries.
  • Hands-on experience with mechanical design and modeling using tools such as Creo, SolidWorks, or NX.
  • Expertise in simulation tools such as ANSYS, Abaqus, or FloTHERM for thermal/structural analysis.
  • Proven experience in DFM, DFA, and transition of mechanical designs to high-volume manufacturing.
  • Deep understanding of materials science, including polymers, metals, and thermal materials.
  • Experience conducting reliability testing: thermal cycling, vibration, drop/shock, and HALT/HASS.
  • Strong problem-solving and analytical skills with a focus on root cause analysis and continuous improvement.
  • Excellent communication skills to engage with global engineering, operations, and customer teams.

Nice To Have Skills/Experience

  • Ph.D. in Engineering or equivalent.
  • Experience with micro-mechanics, co-packaged optics, or liquid cooling solutions.
  • Familiarity with data analytics, Six Sigma methodologies, or AI-driven simulation optimization.
  • Experience working on system-level hardware such as AI servers, switches, or RF modules.
  • Patent filings or published research in mechanical design, thermal management, or materials.
  • Experience managing cross-functional or global engineering projects.

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