PIC Packager

What You'll Do

• Design and develop packaging solutions for photonic integrated circuits and optical modules.
• Define assembly processes including fibre attach, optical alignment, die bonding, flip-chip integration and electrical interconnects.
• Work with internal and external manufacturing partners to support prototype builds and production scaling.
• Develop packaging architectures that optimise optical performance, thermal management and long-term reliability.
• Support package qualification through environmental, thermal and reliability testing.
• Collaborate with PIC designers, process engineers and test teams to resolve integration challenges.
• Drive continuous improvements in packaging processes, yield and manufacturing efficiency.

What We're Looking For

• Bachelor's, Master's or PhD in Photonics, Electrical Engineering, Mechanical Engineering, Materials Science or a related discipline.
• Several years of experience developing packaging solutions for photonic or optoelectronic devices.
• A strong understanding of optical alignment, fibre coupling and photonic assembly techniques.
• Experience with semiconductor packaging processes including die attach, wire bonding, flip-chip or advanced packaging technologies.
• Knowledge of thermal management, mechanical design and reliability considerations for optical devices.
• Experience working with external packaging vendors or contract manufacturers.
• Strong analytical and problem-solving skills within cross-functional engineering environments.

Nice to Have

• Experience packaging silicon photonics, co-packaged optics or optical interconnect products.
• Knowledge of fibre-array attachment, passive and active alignment techniques.
• Familiarity with automated assembly equipment and process development.
• Experience with finite element analysis (FEA), thermal simulation or optical tolerance analysis.
• Python or MATLAB experience for data analysis and process optimisation.