Packaging Research and Development Engineer

About the role

Intel's Substrate Packaging Technology Development (SPTD) organization is seeking a talented and driven Packaging Research and Development Engineer to join the Module Engineering Backend team in Chandler, Arizona. This role offers a rare opportunity to be part of a world-class, first-of-its-kind embedded die packaging facility, shaping the future of substrate packaging technology. You will work on developing and scaling advanced substrate packaging technologies that enable die disaggregation and heterogeneous integration, critical frontiers in modern semiconductor engineering.

The majority of your time will be spent on the factory floor, working hands-on with cutting-edge equipment and materials, collaborating with world-class engineers, and engaging directly with equipment and material suppliers to push technological boundaries.

Responsibilities

• Define and establish equipment configurations, process specifications, and integrated process flows for new and emerging packaging technologies.
• Plan and conduct comprehensive Design of Experiments (DOEs) to characterize process windows and understand interactions between processes, equipment, and materials.
• Drive continuous improvements in process capability, stability, quality, reliability, cost, yield, automation, and productivity.
• Lead and participate in cross-functional and cross-organizational teams supporting substrate technology development.
• Engage and collaborate with equipment and materials suppliers to evaluate, qualify, and optimize new technologies and solutions.
• Apply advanced analytical and characterization techniques to evaluate organic and inorganic materials and processes.
• Leverage statistical data analysis tools and programming skills to derive actionable insights from complex datasets.

Qualifications

Minimum Qualifications:

• PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a closely related field.
• 1+ years of relevant experience in a science or engineering field (academic research, internships, or professional experience).

Preferred Qualifications:

• 1+ years of experience in engineering troubleshooting and analytical problem-solving on integrated technology challenges within cross-functional teams.
• Experience owning and operating process tools, with knowledge of Statistical Process Control (SPC), Process Change Systems (PCS), Request for Change (RFC) processes, equipment troubleshooting, statistical design of experiments, and process development.
• Experience with organic and inorganic materials and processes, including characterization techniques such as DSC, TGA, D/TMA, Titration, ICP-MS, FTIR, XPS, TOF-SIMS, EDX, and SEM.
• Proficiency in statistical data analysis tools including JMP, JSL, and Python; familiarity with relational database structures and machine learning concepts.

Skills

• Clear and confident communication (written and verbal) in a collaborative team environment.
• Natural curiosity and drive to solve complex, ambiguous problems with creativity and persistence.
• Adaptability to evolving priorities and comfort with ambiguity and flexibility.
• Ability to build strong, productive relationships with colleagues, suppliers, and cross-functional partners.
• Ownership and accountability for work, with a proactive, solutions-oriented mindset.
• Openness to occasional travel (less than 5%) to engage with suppliers and partners.

Benefits

Intel offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs such as health, retirement, and vacation.

Pay

Annual Salary Range for roles in the US: $133,800.00 - $188,890.00 USD. Individual pay is determined by work location, job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America).

Primary location: Chandler, Arizona (US).