Packaging Development Engineer

About the role

Join a premier industry leader to shape cutting-edge sensors and build the future of technology with an innovative, global team.

Responsibilities

• Process Development: Design, develop, and qualify new package types and assembly processes (such as die attach, wire bond, and flip-chip) from prototype through to high-volume production.
• Manufacturing Optimization: Define process flows, execute Design of Experiments (DOE), and analyze results with statistical tools to maximize yield, performance, and manufacturability.
• Supplier Collaboration & Compliance: Partner with suppliers and contract manufacturers to qualify materials and equipment, ensuring strict adherence to industry standards, environmental regulations, and customer requirements.
• Testing & Failure Analysis: Oversee environmental qualification testing, conduct hands-on failure analysis using techniques like X-ray or C-SAM, and drive root-cause corrective actions.
• Global Production Support: Transfer manufacturing processes to global facilities, traveling to hubs in Asia and Mexico to troubleshoot yield issues, oversee production ramps, and mentor junior engineers.

Qualifications

• Bachelor's degree in Engineering
• Minimum 3 years of experience in semiconductor/sensor packaging and MEMS

Skills

• Packaging
• Process Development

Pay

$95,000 - 130,000 per year

Schedule

8am to 4pm

Benefits

Comprehensive benefits package including medical, prescription, dental, vision, AD&D, and life insurance offerings, short-term disability, and a 401K plan (all benefits are based on eligibility).