Optical Packaging Engineer

About the role

We're seeking a talented and driven Optical Packaging Engineer to lead the development of next-generation optical solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize optical coupling efficiency and ensure seamless transition to mass production. You will own the design and development of fiber pigtail, lens coupling, and free space optics while staying abreast of cutting-edge technologies.

Responsibilities

• Lead next-generation optical package design in collaboration with cross-functional teams, stakeholders, and vendors to ensure package requirements are met.
• Own all development of optical coupling activities and designs: fiber pigtail, lens alignment and coupling, free space optics, gratings, collimators, etc.
• Optimize the optical coupling efficiency of optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets.
• Hands-on process development with R&D manual aligners and automated aligners within Nokia premises.
• Survey advanced optical coupling solutions, materials, and vendors to stay current with new technological advancements.
• Own and maintain the process and manufacturing documentation, along with the Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Support development activities at our Contract Manufacturers, both remotely and on-site, to ensure a smooth transition to mass production.

Requirements

• 2-4 years of experience.
• Experience in high-speed electronics package design and laser package design.
• Experience with optical coupling, fiber pigtail attachment, and free space optics.
• Experience in microelectronics, optoelectronics packaging design, and assembly.
• Knowledgeable in packaging technologies and processes, including glass/ceramic/metal material properties and multilayer materials interfaces after bonding.
• Hands-on experience with automated alignment tools, fiber optics, epoxy dispensation, optical measurement, and metrology.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication, and problem-solving skills to interact effectively with engineering staff, external vendors, and contractors.
• Experience with package and process design/development from design to production.

Preferred Qualifications

• Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools such as DOE, SPC, and Six-Sigma process and analysis.
• Familiar with industry test standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.
• Expertise in high-volume packaging of 2.5D/3D packages.
• Knowledge of material properties and associated mechanical part fabrication processes.
• Familiar with flip chip, BGA, PCBA, flex design reliability, and processing.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging—or equivalent practical work experience.

About Us

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile, and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world. Learn more about life at Nokia.

Benefits

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability and long-term disability
• Life insurance and AD&D – Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.