Ocotillo Failure Analysis Engineer – TEM/AutoTEM Engineer

Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives.

About the Role

As a Manufacturing Failure Analysis Engineer, you will be instrumental in identifying and resolving failures in silicon, components, and systems, driving improvements in yield, quality, and reliability. On a day-to-day basis, you will define failure analysis strategies, perform hands-on lab evaluations, and thoroughly investigate electrical and mechanical characteristics to pinpoint root causes. Your work will directly contribute to advancing Intel's next-generation technologies and ensuring the success of future products.

Intel's Failure Analysis (FA) Lab in Chandler, Arizona is seeking a highly motivated AutoTEM/TEM Engineer to support high-volume manufacturing and yield improvement for advanced semiconductor technologies. In this role, you will perform automated and manual transmission electron microscopy (AutoTEM/TEM) analysis, enabling rapid defect characterization, process learning, and root cause identification. You will work closely with FA, yield, and process engineering teams to deliver high-quality data and accelerate debug cycles. This is an excellent opportunity for early-career engineers to develop expertise in advanced metrology, TEM workflows, and semiconductor failure analysis in a fast-paced production environment.

Responsibilities

• Operate AutoTEM and manual TEM workflows to support failure analysis and yield learning
• Prepare and analyze TEM samples, including coordination with FIB/PFIB and SEM processes
• Execute automated TEM job submissions and interpret results for engineering teams
• Analyze imaging data to identify defects, process issues, and device structural differences
• Partner with FA and yield teams to integrate TEM analysis into debug flows
• Support high-volume lab operations, including prioritization, throughput, and turnaround time
• Contribute to development and improvement of AutoTEM flows and best known methods (BKMs)
• Assist with tool ownership activities such as monitoring tool health, troubleshooting, and continuous improvement
• Maintain strong documentation of methods, results, and learnings

Requirements

• Bachelor's degree in Engineering or Physics related field
• US citizenship required
• Ability to obtain and maintain a US Government Security Clearance
• Basic understanding in one of the following:
  • Semiconductor manufacturing processes and device physics
  • Materials characterization
  • Microscopy theory/experience

Qualifications

• Proficiency in failure analysis tools and techniques, including electrical testing, microscopy, and material characterization
• Hands-on experience in failure analysis or quality assurance, with demonstrated skills gained through internships, academic projects, coursework, or hands-on training
• Master's degree in a relevant field with no prior professional experience
• Exposure to microscopy, materials characterization, or lab-based work
• Academic or industry experience with:
  • TEM, SEM, or FIB-based techniques
  • Semiconductor processing or failure analysis workflows
• Familiarity with data analysis and image interpretation
• Knowledge of advanced node device structures or process integration
• Experience working in a lab or high-volume manufacturing environment
• Active US Government Security Clearance, with a minimum of Secret level

Skills

• Strong attention to detail and data quality
• Ability to work in a fast-paced, high-throughput lab environment
• Effective communication and collaboration across cross-functional teams
• Demonstrated ownership and willingness to learn new tools and techniques
• Ability to balance multiple priorities and meet turnaround expectations

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $76,390.00 - 125,660.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.

Schedule

This role requires an on-site presence on Shift 1 (United States of America).