Ocotillo Failure Analysis Engineer – TEM/Probing Engineer
About the role
Join Intel as a Manufacturing Failure Analysis Engineer and play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products.
You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future.
Responsibilities
- Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes.
- Perform electrical probing and advanced characterization on silicon devices (wafer-level and site-specific structures).
- Set up, operate, and troubleshoot probe stations and electrical measurement systems.
- Execute complex test plans and interpret schematics, layouts, and device structures to support failure analysis workflows.
- Analyze electrical data (e.g., IV, CV, leakage, shorts/opens) to support fault isolation and root cause identification.
- Partner with FA engineers to integrate probing with SEM, FIB/PFIB, and TEM-based workflows.
- Drive improvements in probing methods, workflows, and best-known methods (BKMs).
- Provide technical guidance to junior engineers and technicians on probing techniques and lab practices.
- Support tool ownership activities including troubleshooting, calibration, and uptime improvement.
- Participate in lab sustaining, process transfer, and cross-functional yield improvement initiatives.
Requirements
- Bachelor's degree in Electrical Engineering, Materials Science, Physics, Engineering or related STEM fields.
- 2+ years of hands-on experience with TEM or FIB or SEM or nanoprobing instrumentation in a lab or applications setting in other techniques OR 2+ years of experience in a lab setting where samples are prepared for analysis.
- US citizenship required.
- Ability to obtain and maintain a US Government Security Clearance.
Preferred Qualifications
- MS, or PhD in Materials Science, Physics, Engineering or related STEM fields.
- Possibility of working a shifted schedule with at least one weekend day at least two weeks a month (Sunday-Thursday or Tuesday-Saturday).
- Knowledge of semiconductor process fundamentals and advances in fabrication technology over the past decade.
- Knowledge or direct experience with general failure analysis tools in a semiconductor laboratory.
- Demonstrated independent quick-learning ability on lab instrumentation.
- Excellent verbal and written communication skills.
- Demonstrated ability to lead and manage lab staff.
- Prior experience working with US Government contracts including security and sensitive document handling and/or Top-Secret US Government clearance.
- Active US Government Security Clearance, with a minimum of Secret level.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Pay
Annual Salary Range for jobs which could be performed in the US: $103,730.00 - 170,630.00 USD. The range displayed reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Schedule
This role will require an on-site presence and may include working a shifted schedule with at least one weekend day at least two weeks a month (Sunday-Thursday or Tuesday-Saturday).