Module Development Engineer - CMP

About the role

Join Intel and help build a better tomorrow. Intel is transforming to create and extend computing technology that connects and enriches the lives of every person on Earth. As a Chemical Mechanical Planarization (CMP) Process Development Engineer in Logic Technology Development (LTD), you will develop and sustain planarization techniques for a variety of materials and architectures, enabling rapid miniaturization in the semiconductor industry and mass production of integrated circuits. CMP techniques combine physics, chemistry, materials science, and surface science, fostering collaboration across diverse scientific backgrounds.

This role requires an on-site presence.

Responsibilities

• Drive technology development and enablement for high-volume manufacturing and future technology, providing process integration and equipment solutions, and performing feasibility studies to meet device specifications.
• Lead design and development of sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Perform pathfinding activities to support process and hardware development for innovative device architectures, and develop roadmaps for future technologies.
• Recommend and implement equipment modifications to improve production efficiency, manufacturing techniques, and optimize output for existing products.
• Partner with key equipment and materials suppliers to develop and implement enabling elements of the technology.
• Conduct process technology feasibility studies through theoretical simulations and practical engineering methods.
• Stay updated on industrial process and material manufacturing trends, and develop a vision for future Intel process technology needs by collaborating with the vendor ecosystem to build a cost-sensitive roadmap.

Requirements

• Bachelor’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field with 5+ years of semiconductor industry experience (processing and fabrication), OR
• Master’s degree in the same fields with 4+ years of semiconductor industry experience, OR
• PhD in the same fields with 1+ years of semiconductor industry experience.

Preferred Qualifications

• PhD in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field.
• Direct experience in Chemical Mechanical Planarization (CMP) process development, including hands-on process tuning and characterization.
• Experience with major CMP equipment platforms (e.g., AMAT, Ebara).
• Experience with CMP consumables (e.g., slurries, pads, conditioning disks, filters, clean chemistries).

For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information.

Benefits

Intel offers a total compensation package that ranks among the best in the industry, including competitive pay, stock bonuses, and benefit programs such as health, retirement, and vacation.

Pay

Annual salary range for this position in the U.S.: $133,800 - $255,200 USD. Individual pay is determined by job-related skills, experience, and relevant education or training, and may vary by location.

Schedule

This role follows Shift 1 (United States of America) and requires an on-site presence at the primary location: US, Oregon, Hillsboro.