Module Engineer

Key Responsibilities

• Lead development and optimization of manufacturing processes, equipment, and systems for high-volume production environments
• Conduct feasibility studies, pathfinding activities, and theoretical simulations to support innovative device architectures and process development
• Design, develop, and validate test programs to ensure integrated circuits function as intended and meet performance specifications
• Implement modifications and improvements to equipment operations targeting safety, quality, cost, productivity, and yield optimization
• Collaborate with equipment and material suppliers to design critical technology enablement elements and refine process requirements
• Execute maintenance, repair, and continuous improvement activities for production equipment and associated manufacturing components
• Develop roadmaps for technology solutions that align with Intel's future product needs and manufacturing capabilities
• Monitor product health, analyze performance data, and resolve yield issues through systematic troubleshooting and root cause analysis
• Lead technology transfer initiatives to global manufacturing sites through training programs and process standardization
• Establish material specifications and quality standards while interfacing with supplier quality and procurement teams
• Drive standardization in manufacturing quality systems, product qualification methods, and process documentation
• Resolve discrepant material issues and contain quality excursions

Qualifications

• Doctorate degree or foreign equivalent in Material Science &/or Engineering, Electrical/Mechanical/Chemical Engineering, or other STEM-related degree

Annual Salary Range

Annual Salary Range for jobs to be performed in Hillsboro, OR: $144,253 - $170,630 USD

Job Type

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

(Not specified)

Work Model

This role will require an on-site presence.