Mgr II System Architecture - Datacenter Interconnect Standards

Key Responsibilities

• Lead, mentor, and develop a diverse team of system architects and engineers, including experts in mechanical, electrical, signal integrity, power integrity, and system architecture.
• Foster a culture of continuous learning, technical excellence, and innovation, ensuring the team remains at the forefront of compute and networking advancements.
• Conduct regular performance reviews, provide constructive feedback, and create individualized development plans to accelerate career growth.
• Recruit, retain, and develop world-class talent, ensuring TE has the technical expertise needed to lead the industry.
• Encourage collaboration and knowledge sharing, breaking down silos and promoting cross-functional teamwork.
• Provide leadership in system-level trade-offs, design decisions, and risk assessment.
• Facilitate cross-functional collaboration, ensuring effective communication between technical teams, business leaders, and external partners.
• Manage multiple high-impact projects, ensuring seamless execution from early-stage concept to product development.
• Build and maintain strong relationships with key OEMs, hyperscalers, and industry leaders, ensuring TE is aligned with evolving customer needs.
• Influence executive leaders and cross-functional stakeholders, driving investments in new technologies and product innovations.

Skills, Experience And Education

• Bachelor’s degree or higher in Electrical Engineering, Mechanical Engineering, or Engineering Management; a dual degree in business or MBA is a plus.
• 12+ years of technical experience in data center, compute, AI, networking, or storage industry, with at least 5+ years leading multi-disciplinary teams.
• Proven track record of leading and motivating geographically dispersed, high-performance engineering teams with the ability to develop technical talent and drive innovation.
• Ability to manage multiple technical projects simultaneously, balancing strategic and tactical execution.
• Strong relationship-building skills, with experience engaging with external customers, industry leaders, and internal executives.
• Direct participation in at least one major body (SNIA, INCITS, STA, PCI-SIG, IEEE 802.3, CXL, OIF, or similar), including ballot review and contribution authorship.
• Expertise in high-speed signaling, and electrical/optical interconnects is a plus.
• Experience with industry-standard design tools (e.g., simulation, modeling, CAD, or signal integrity analysis) is a plus.
• Willingness to travel (25-30%) for customer engagements, industry events, and TE development sites.

Compensation

Competitive base salary commensurate with experience: $177,800 – $266,600 (subject to change dependent on physical location)