Metrology & Inspection Engineer

About the role

Touchdown is engineering the manufacturing behind storage, memory systems, and other chips. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today. You will decide how a candidate process is measured before anyone calls it qualified. Select methods for the features and defects that matter, establish calibration and measurement-system performance, and connect inline results to electrical, package, and reliability outcomes. This is an independent evidence role: when a measurement cannot support a release claim, the material stays on hold.

Responsibilities

• Specify independent measurements for dimensions, alignment, thickness, surfaces, defects, and package integrity.
• Select measurements for each CTQ and specify gauge capability before process comparisons.
• Establish calibration, reference artifacts, sampling, tool correlation, and data lineage.
• Separate true process variation from measurement bias or repeatability error.
• Compare destructive and nondestructive methods and quantify what each can miss on the chosen workpiece.
• Set tool matching, reference standards, review thresholds, and escalation for out-of-control or ambiguous results.
• Produce a measurement-system analysis with tool correlation, uncertainty, sampling, and pass/fail limits.
• Develop a measurement plan linking each CTQ to tool, method, frequency, owner, and reject rule.
• Create a gauge qualification report with uncertainty and cross-tool correlation.
• Assemble a measurement-system qualification packet with standards, repeatability, bias, uncertainty, sampling plan, and release limits.
• Ensure independent reviewers can trust the measurement behind a release decision.
• Verify the measurement system detects defects that matter to the customer.
• Enable two qualified reviewers to reproduce the same disposition from the same calibrated evidence.
• Use inline signals to predict or explain final test and reliability outcomes within stated uncertainty.

Requirements

• Gauge selection, calibration, sampling, measurement uncertainty, and semiconductor inspection.
• Owned semiconductor or packaging metrology and inspection methods.
• Ability to run MSA, gauge R&R, correlation, and uncertainty analyses.
• Ability to set pass/fail limits without silently moving them after results arrive.
• Experience building and maintaining measurement or inspection recipes and control charts.
• Ability to investigate measurement drift separately from process drift and document the difference.

Qualifications

• Helpful experience with optical, X-ray, acoustic, profilometry, or electrical inspection.
• Experience with automated defect classification.
• Background in advanced-package inspection.
• Experience correlating to electrical test and failure analysis.

Skills

Optical, electron, X-ray, dimensional, electrical, mechanical, and surface measurements as applicable; calibration, gauge repeatability and reproducibility, sampling, recipe control, defect classification, SPC, capability, and measurement-data lineage.