Memory/Advanced Packaging Strategy Technologist
Memory Technology Roadmap and Strategy supporting the Varian Business Unit of the Silicon Products Group.
About the role
The incumbent will play a key role in the organization serving both internal and external customers. This role encompasses several responsibilities including supporting the strategic planning processes for the business units, supporting market sizing, forecasting and analysis function, and constructing high-level messages and presentations for internal, corporate, and external audiences.
Responsibilities
- Understand industry technology roadmap as well as key path finding activities for next 10 years and implications to Applied
- Work with a team of marketing, technical, and engineering professionals to identify key challenges for future memory technologies with focus on Memory and Advanced Packaging.
- Understand technology inflections in Memory technology and translate to process equipment requirements.
- Integrated demo and integration support to Business Units
- Write and file IP to protect developed integration solutions.
- Develop technical/ marketing collateral to promote Applied Materials solutions.
- Gather data, analyze customer and competitor strategies to meet inflection needs, provide updates and act as a thought partner to a variety of stakeholders.
- Support nodal sizing, forecasting and market share analysis for the Business Units, clearly understanding the impact of upcoming technology changes and inflections and their impact to the Business Units.
- Analyze the technology and economic environment including monitoring end-user trends impacting market demand, identifying emerging new markets, and tracking worldwide customer investment plans, technology adoption and changes to the customer landscape.
- Track competitors’ positions by customer/inflection segment and assist in sizing and prioritizing specific penetration opportunities.
- Assist, as needed, in constructing executive presentations for internal and external audiences.
Requirements
- Excellent understanding of Memory technologies such as DRAM, NAND and knowledge of process integration and device physics is required.
- Good understanding of advanced packaging processes and integration schemes is a strong plus.
- At least 5 years of experience in semiconductor processing as a lead process integration engineer or device engineer working on leading edge technology.
- Advanced degree (M.S./ Ph.D) in Materials Science/ Electrical Engineering/ Chemical Engineering/ Physics or related fields is required.
- Excellent presentation skills, data analysis skills, and communication skill.
- Ability to work effectively with all levels and functional areas.
- Knowledge of effective use of AI applications for engineering process optimization is desirable.
Qualifications
- Anticipates business and regulatory issues; recommends product, process or service improvements.
- Leads projects with notable risk and complexity; develops the strategy for project execution.
- Solves unique and complex problems with broad impact on the business; requires conceptual and innovative thinking to develop solutions.
- Impacts the direction and resource allocation for program, project or services; works within general functional policies and industry guidelines.
- Communicates complex ideas, anticipates potential objections and persuades others, often at senior levels, to adopt a different point of view.
Skills
- Knowledge of effective use of AI applications for engineering process optimization is desirable.
Benefits
Salary: $148,000.00 - $203,500.00
Location: Gloucester,MA
You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
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