Advanced Packaging Technologist

This role is part of the Jobright TNT—a private hiring network connecting top talent with top AI startups like Perplexity, Mercor, Cresta, Suno, and 150+ more. Only select, high-signal candidates are invited and recommended directly to hiring teams.

About the Company

MediaTek is one of the world’s leading fabless semiconductor companies, building industry-leading SoCs that power smartphones, smart devices, automotive, and the next generation of edge AI computing.

• Generated over $19B in revenue in 2025, with flagship smartphone revenue growing over 40% YoY while powering 2B+ connected devices annually.
• Join one of MediaTek’s fastest-growing engineering teams, expected to double as the company accelerates its AI computing strategy.
• Play a key role in MediaTek’s transformation into an AI computing platform company, spanning flagship mobile, edge AI, AI PCs, automotive, and AI silicon.
• Solve some of the industry’s toughest hardware-software co-design challenges for next-generation AI computing and flagship mobile platforms.

Responsibilities

• Collaborate with internal teams, external customers, and key partners to develop advanced packaging solutions from concept to mass production.
• Coordinate with package design, substrate, and assembly partners to select materials and BOM, ensuring manufacturability and meeting electrical, mechanical, thermal, and system-level requirements.
• Lead and coordinate projects across design, engineering, supply chain, manufacturing, and quality assurance to ensure successful execution.
• Establish and maintain strong relationships with suppliers, customers, and internal teams to meet project requirements and resolve supply chain or manufacturing issues.
• Monitor and report on project progress, supply chain performance, and manufacturing metrics to senior management.

Requirements

• Expertise in 2.5D/3D package architecture and advanced packaging technologies such as CoWoS, EMIB, SoIC, CoW, WoW, POP, etc.
• Working knowledge of package design, electrical signal integrity, power integrity, thermal, and thermomechanical principles, with a fundamental understanding of 2.5D/3D package challenges.
• Experience with wafer level processes, package assembly processes, and substrate technology.
• Strong supply chain and quality management skills, including BOM management, procurement, logistics, and inventory.
• Understanding of legacy packaging technologies, package failure mechanisms, and quick problem-solving skills.
• Ability to develop and maintain strong relationships with key enablement partners and customers, ensuring smooth communication and alignment on project requirements, product quality, reliability, system, and operational needs.
• Excellent communication skills.
• 10-15% international travel required.

Pay

$180K/yr - $272K/yr