Advanced Packaging Engineer

About the role

We are seeking an experienced Plasma Etch Process Development Engineer to join our advanced packaging team. The successful candidate will develop, optimize, and implement dry etch processes for next-generation semiconductor packaging technologies including 2.5D/3D integration, chiplet packaging, and heterogeneous integration solutions.

Responsibilities

• Develop and optimize plasma etch processes for advanced packaging applications.
• Design experiments (DOE) to characterize process windows and optimize etch performance.
• Develop and execute technology roadmaps to meet future manufacturing needs while pushing industry standards forward.
• Partner with equipment suppliers to design, test, and implement innovative process solutions.
• Monitor and optimize production efficiency, yield, and manufacturing techniques for existing products.
• Identify and implement modifications to improve equipment performance, reduce costs, and enhance production output.
• Collaborate cross-functionally to develop scalable, robust manufacturing solutions aligned with Intel's strategic objectives.

Requirements

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Qualifications

• Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field.
• Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
• Experience in process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes.
• Experience with Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement.

Skills

• Experience in wafer-level assembly, advanced packaging, or related technologies.
• Demonstrated success in leading programs from initial strategy development through high-volume production.
• Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions.
• Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as benefit programs which include health, retirement, and vacation.

Pay

Annual Salary Range for jobs which could be performed in the US: $148,100.00 - $209,100.00. Salary range dependent on a number of factors including location and experience.

Schedule

This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.