Advanced Packaging Engineer

Position Summary

The Advanced Packaging Engineer is a senior individual contributor responsible for conceiving, architecting, and maturing next-generation optical and optoelectronic technologies. This role focuses on future-state capability creation, advanced materials and packaging architectures, and long-term technology differentiation. The position operates upstream of production and is not responsible for sustaining engineering or day-to-day manufacturing support.

Essential Duties And Responsibilities

• Define and develop next-generation optical and optoelectronic packaging architectures.
• Lead architectural trade studies considering optical performance, materials behavior, and future scalability.
• Establish technology concepts that enable future product families and platforms.
• Research emerging materials, processes, and assembly technologies aligned with long-term company roadmaps.
• Lead feasibility studies, proof-of-concept efforts, and early-stage demonstrations.
• Evaluate technology readiness levels and define pathways for maturation.
• Define characterization and reliability evaluation methodologies for early-stage technologies.
• Analyze optical, mechanical, and thermal data to inform design decisions.
• Identify technical risks and failure mechanisms early in development.
• Contribute to long-term optics and optoelectronics technology roadmaps.
• Support senior leadership through technical reviews and risk assessments.
• Identify capability gaps and propose strategic development initiatives.
• Identify and partner with material suppliers, equipment vendors, and research institutions.
• Lead joint development initiatives with external partners.
• Influence external technology roadmaps to align with future needs.
• Contribute to intellectual property, publications, and technical knowledge growth.
• Mentor engineers on advanced technology concepts.

Required Education

• BS in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or a related field required.
• MS or Ph.D. preferred.

Required Experience

• 15+ years of experience in optical, optoelectronic, or advanced microelectronics development.
• Extensive background in materials, packaging architectures, and advanced process development.
• Demonstrated experience creating and maturing new technologies from concept through early validation.
• Proven record of technical leadership and independent problem solving.

Salary and Benefit Offerings

The preferred location for this position is the Samtec Vista Design Center in San Diego/Vista, CA. At this site, the salary range is $187,000 – $212,000 annually, based on experience, plus generous Samtec bonuses paid three times per year (February, August, and late fall). A secondary option is the Silicon Valley Design Center in Santa Clara, CA, where the salary range is $220,000 – $250,000 annually, based on experience, plus the same bonus structure. The third location is the Samtec Microelectronics facility in Colorado Springs, CO, with a salary range of $159,000 – $180,000 annually, based on experience, plus bonuses as noted above. Relocation assistance is available only for moves to the preferred location (San Diego/Vista, CA).

Samtec's generous benefits package includes medical (HSA/PPO), dental, vision, hearing, group life, AD&D, short- and long-term disability, EAP, 401K match / profit sharing (Samtec will contribute 7% of your total gross pay to your 401(k) plan regardless of any contributions you make and will match the first 5% of your contribution to the 401(k)-plan dollar for dollar), plus other voluntary options, as well as paid time off.