Mechanical - Thermal Engineer (HH)

About the role

Foxconn Industrial Internet (FII) is seeking a highly motivated Thermal Mechanical Engineer (or equivalent) to contribute to the cooling of servers. The role involves working on R&D, performing thermal solutions, collaborating with cross-functional teams, investigating new technology, and compiling test reports.

Responsibilities

• Work on R&D, perform thermal solutions with specifications, analytical and computational analysis, designs and characterizations including CFD simulations and CAD designs, along with laboratory validations of prototypes and manufacturing implementations from chip-to-board level thermal solutions through focus on system level to deliver innovative, compliant and commercially viable server products to the marketplace in a timely and cost-effective manner.
• Collaborate with cross functional product development teams and overseas partners to meet reliability, power efficiency, system performance, and cost requirements.
• Investigate new technology and designs during the product lifecycle of the project and drive design decisions; analyze/implement trade-offs while contributing to thermal solutions of product designs from conceptualizations to productions.
• Compile test reports, summaries, and document investigations to contribute to insights to system layouts and product/solution improvements.
• Report analyses results and design specifics to internal managements and external customers.

Qualifications

• Minimum of Bachelor’s degree in an Engineering Discipline. An advanced engineering degree (MS or Ph.D.) with an emphasis on thermal sciences would be an added plus.
• Strong fundamental backgrounds in heat transfer and fluid mechanics, understanding of cooling techniques for electronic components and equipment such as the passive and active heat transfer, air cooling, liquid cooling, two-phase immersion cooling, heat sinks, heat pipes, vapor chambers and fans thorough graduate level course works or industry experiences.
• Knowledge of semiconductor, package and PCB designs and thermal testing. Experience working with Integrated Circuit (IC) physical design parameters affecting electrical and thermal performance of packaging technologies.
• Knowledge of the thermal analysis and computational modeling, development of thermal solutions and methodologies at the server and system-level for semi-conductor products, data analysis and product characterizations, optimizations of thermal controls for increased quality and cost improvements, developments of thermal management techniques
• Strong knowledge of CFD principals as well as working experiences in creating analytical and numerical modes using CFD tools such as FloTherm, ANSYS-IcePak and Fluent etc.
• Experience with defining thermal test plans, design of experiments on prototypes. Experiences in instrumentations, data acquisitions and data analysis, including uncertainty analysis. Experiences with various temperature, pressure and fluid flow measurement techniques. Basic controls, automations, acoustical knowledge is a plus.
• Some experience with 3D/2D models utilizing CAD tools such as PTC Creo or Pro/Engineer or SolidWorks etc. is a major plus.
• Good ability to visualize and clarify product needs from fundamental concepts through system considerations to ensure optimized designs.
• Good written and verbal communication skills, strong analytical and problem solving ability and effective teamwork throughout the organizations.

Benefits

• 401(k) with matching contributions
• Health, Dental and Vision insurances
• Disability insurance
• Health savings account
• Life insurance
• Paid Time Off

Schedule

Full-time, on-site role, based in Houston, TX office.

Pay

N/A