Mechanical Engineer II - Microelectronics Packaging

Date Posted: 2026-08-19 | Location: San Diego, CA (8650 Balboa Ave) | Onsite role

U.S. citizenship is required; ability to obtain and maintain a DoD Secret security clearance is mandatory. An active and existing security clearance is required from day one.

About the Role

Support development of novel advanced microelectronics packaging solutions within a team environment for a broad range of design challenges supporting advanced radar systems and subsystems throughout various IRAD, Development, and Production environment programs.

Responsibilities

• Utilize standard hardware and materials to develop novel design and assembly approaches for advanced electronics.
• Perform mechanical analysis of packages and systems including first-order structural, thermal, and tolerance analyses.
• Support the full mechanical design lifecycle: requirements development, concept generation, trade studies, material selection, free-body diagram development, and geometric dimensioning & tolerancing (GD&T).
• Create and support 3D models, engineering drawings, tolerance analyses, and manufacturing documentation using PTC Creo Parametric and Windchill Product Data Management System.
• Partner with manufacturing and test teams to support prototype builds, tooling development, integration activities, and verification testing.
• Participate in technical and design reviews ensuring designs meet performance, quality, manufacturability, and reliability requirements.
• Support mechanical development efforts for microelectronics packages and higher-level assemblies balancing technical performance, schedule, cost, and risk.
• Work with a multi-disciplined team on mechanical housing design, electronics equipment packaging, circuit card assemblies, interconnects, and thermal management.
• Create and deliver presentations with clear and concise technical content.
• Travel a minimum of 25% to suppliers and production facilities, including domestic and international destinations.

Requirements

• Master’s degree in Mechanical Engineering, Aerospace, Engineering Science, Physics, Math, or related STEM major obtained by start date.
• Experience with the design, manufacturing, and integration of mechanical assemblies, electronics packaging, and/or test equipment for military and/or aerospace applications.
• Experience with Mil-Spec hardware and material selections.
• Experience with PTC CREO Parametric or other mechanical CAD tools.
• Experience may be obtained through on-the-job experience, research, coursework, or projects.

Preferred Qualifications

• Demonstrated mechanical engineering design knowledge.
• Existing Secret or Top Secret security clearance.
• Experience with ANSI/ASME Y14.5 GD&T (Geometric Dimensioning and Tolerancing).
• Printed Wiring Board (PWB) design and fabrication knowledge.
• Circuit Card Assembly (CCA) design and layout collaboration experience.
• Knowledge of electromechanical assemblies and the interrelationship of components.
• Knowledge of materials and fabrication methods.
• Knowledge of mechanical fabrication techniques (additive, traditional milling, EDM, etc.).
• Experience with suppliers of machined parts and electronics.
• Ability to interpret standard mechanical fabrication and assembly drawings.
• Experience with production support including use of basic measurement tools.
• Knowledge of environmental testing and validation.
• Strong CAD, technical writing, and oral communication skills.
• Experience creating and delivering technical presentations.

Benefits

• Medical, dental, and vision insurance.
• Life insurance, short-term disability, and long-term disability coverage.
• 401(k) match.
• Flexible spending accounts.
• Flexible work schedules.
• Employee assistance program.
• Employee Scholar Program.
• Parental leave.
• Paid time off and holidays.
• Annual short-term and/or long-term incentive compensation programs (eligibility dependent on role level and collective-bargaining agreement coverage).

Pay

The salary range for this role is $75,800 – $144,200 USD.