Electro-Mechanical Engineer II - Microelectronics Packaging

About the Role

Support development of novel advanced microelectronics packaging solutions within a team environment for a broad range of design challenges supporting advanced radar systems and subsystems throughout various IRAD, Development, and Production environment programs. Utilize a variety of standard hardware and materials to develop novel design and assembly approaches for advanced electronics.

Responsibilities

• Perform mechanical analysis of packages and systems including first-order structural, thermal, and tolerance analyses
• Support the full mechanical design lifecycle, including requirements development, concept generation, trade studies, material selection, free-body diagram development, and geometric dimensioning & tolerancing (GD&T) application
• Create and support 3D models, engineering drawings, tolerance analyses, and manufacturing documentation required for hardware realization primarily using PTC Creo Parametric and Windchill Product Data Management System
• Partner with manufacturing and test teams to support prototype builds, tooling development, integration activities, and verification testing
• Participate in technical and design reviews while ensuring designs meet performance, quality, manufacturability, and reliability requirements
• Support mechanical development efforts for microelectronics packages and higher-level assemblies while balancing technical performance, schedule, cost, and risk considerations
• Work with a multi-disciplined team of engineers on mechanical housing design, electronics equipment packaging, circuit card assemblies, interconnects, and thermal management
• Create and deliver presentations with clear and concise technical content
• Position requires a minimum of 25% of travel to suppliers and production facilities, which includes domestic and international travel

Qualifications You Must Have

• Typically requires a Bachelor of Science degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 2 years' prior relevant experience
• Experience with the design, manufacturing, and integration of mechanical assemblies, electronics packaging, and/or test equipment for military and/or aerospace applications
• Demonstrated Mechanical Engineering Design Knowledge
• Experience with Mil-Spec Hardware and Material Selections
• Experience with PTC CREO Parametric or other Mechanical CAD Tools
• Ability to Obtain a Secret or Top Secret Security Clearance

Qualifications We Prefer

• An Existing Secret or Top Secret Security Clearance
• Experience with ANSI/ASME Y14.5 GD&T (Geometric Dimensioning and Tolerancing)
• Printed Wiring Board (PWB) Design and Fabrication Knowledge
• Circuit Card Assembly (CCA) Design and Layout Collaboration Experience
• Knowledge of Electromechanical Assemblies and the Interrelationship of the Components Therein
• Knowledge of Materials and Fabrication Methods
• Knowledge of Mechanical Fabrication Techniques (Additive, Traditional Milling, EDM, etc…)
• Experience With Suppliers of Machined Parts and Electronics
• Ability to Interpret Standard Mechanical Fabrication and Assembly Drawings
• Experience with Production Support Including Use of Basic Measurements Tools
• Knowledge of Environmental Testing and Validation
• Strong CAD, Technical Writing, and Oral Communication Skills

Pay

The salary range for this role is 75,800 USD - 144,200 USD. The salary range provided is a good faith estimate representative of all experience levels. RTX considers several factors when extending an offer, including but not limited to, the role, function and associated responsibilities, a candidate's work experience, location, education/training, and key skills.