Materials Engineer-Advanced Deposition Technology-at Gelest

About the role

The Materials Engineer – Advanced Deposition Technology supports the development, optimization, and characterization of advanced thin-film and lithographic materials within the Advanced Deposition Technology Center of Excellence (COE).

Responsibilities

• Supports the development, optimization, and characterization of advanced thin-film and lithographic materials.
• Performs wafer coating, thin-film deposition, and lithography process development activities.
• Collaborates closely with scientists, engineers, and cross-functional technical teams to advance technologies impacting industries globally.
• Maintains high reproducibility in nanometer-scale film deposition and processing environments.

Requirements

• Bachelor's degree in Materials Science, Physics, Chemistry, Electrical Engineering, or a related field.
• Minimum 5 years of relevant experience in materials science, semiconductor technology, or similar fields.
• Strong understanding of thin-film deposition techniques and materials characterization methods.
• Experience with semiconductor fabrication processes and equipment.
• Excellent problem-solving skills and ability to work independently and as part of a team.

Qualifications

• Proficiency in laboratory techniques and equipment.
• Ability to work in a fast-paced, dynamic environment with tight deadlines.
• Strong communication and interpersonal skills.

Skills

• Thorough knowledge of thin-film deposition techniques and materials characterization methods.
• Experience with semiconductor fabrication processes and equipment.
• Strong problem-solving and analytical skills.
• Excellent written and verbal communication skills.

Benefits

• Competitive salary commensurate with experience.
• Flexible working hours and remote work options.
• Health insurance and retirement plans.
• Professional development opportunities and ongoing training programs.

Pay

Commensurate with experience.

Schedule

Full-time.