Manufacturing Engineer

Responsibilities

• Work with suppliers and inside production organizations to develop, manage, and improve the PCBA manufacturing process.
• Validate new equipment and processes and continuously seek to improve the production process.
• Support PCBA manufacturing processes and PCBA products.
• Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
• Collaborate with other functional groups to develop wire bond solutions to meet business needs.
• Provide training in die-assembly, wire bond technology, problem analysis and resolution.
• Knowledge and understanding of the following preferred: Mechanical assembly of channel amplifiers, linearizers, or other precision microwave parts and provide MIC assembly technical support.
• Mechanical assembly consisting of housing fabrication for HI-REL RF applications.
• MIC assembly consisting of brazing, die attach, wedge-wedge bonding and gap welding.
• Support test for electrical changes being performed for tuning purposes.
• Able to work under a microscope for extended periods of time.
• Able to have eye to hand dexterity and fine motor skills.
• Estimate manufacturing costs and determine time standards for tooling and process requirements of new or existing product lines.
• Manage work instructions, process documentation, and training within organization and suppliers.
• Identify trends and opportunities for optimizing product output, quality enhancements, and cost of manufacturability.
• Provide feedback to Engineering Design team to improve design for manufacturability.
• Identify, root-cause, and correct SMT production and testing issues.
• Drive corrective actions and process improvements on owned processes and products.

Qualifications

• This role requires relevant engineering experience that includes a combination of or equivalent experience in manufacturing engineering of PCBAs, microelectronics, or similar manufacturing processes.
• Level II: requires a minimum of 2 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Level III: requires a minimum of 4 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Level IV: requires a minimum of 6 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Role also requires: Strong verbal and written technical communication skills.
• Ability to interpret schematics, engineering drawings, and product specifications.
• Basic knowledge of GD&T.
• Strong analytical, fault isolation and problem-solving skills.
• Strong organization skills and attention to details.
• Experience in process design, development and project planning in related fields.
• Experience in preparing and maintaining assembly instructions, drawings, procedures, process routers and Bills of Materials with strong understanding of configuration management.
• Being able to develop and execute Statistical Process Control for Manufacturing.
• Experience in secondary operations including manual (hand) soldering, point to point wiring, and solder rework station processes.
• Understanding of Material behavior such as Thermal fatigue and solder creep preferred.
• Understanding of multilayer and Rigid-Flex PCB manufacturing processes preferred.
• Knowledge of solder joint reliability and fatigue contributing characteristics preferred.
• Able to work in a fast-moving environment under tight schedules and coordinate multiple tasks effectively.