Light Industrial - Assembler

Responsibilities

• Perform high mix SMT and through hole soldering on printed circuit boards (PCBs) in accordance with work orders, engineering drawings, and IPC standards.
• Remove, replace, and rework components, including bottom terminated devices (QFNs, BGAs, LGAs) using hot air pencils, hot plates, reflow ovens, and specialty rework stations.
• Conduct X ray inspection of reworked bottom terminated parts, evaluate solder joint integrity, and document findings.
• Execute board level verification (visual, AOI, X ray) and functional testing to ensure conformance to specifications.
• Interpret and follow engineering change orders (ECOs) and bills of materials (BOMs); apply "build to print" practices where required.

Requirements

• Minimum 5 years of hands-on SMT/TH solder assembly in a high mix, low volume environment (aerospace, defense, or similar).
• Additional certification (e.g., IPCA610, IPCJSTD001) preferred.
• Ability to sit for extended periods and lift to 25 lb (11 kg).
• Vision acuity (or corrective lenses) sufficient for detailed microscope work.