Integrated photonic-electronic-quantum systems research for future space missions

About the role

This opportunity involves research and development activities in the following technology areas: 1. Chip-scale stable laser systems using MEMS and nanophotonic technologies including but not limited to silicon nitride on-chip etalons and waveguides, lithium niobate modulators and waveguides, heterogeneous integration/packaging of photonic microdevices, on-chip precision atomic and molecular spectroscopy, physics and chemistry with chip-scale atomic and molecular vapor cells and photonic integration/packaging interfaces; 2. Supporting DC, RF, and microwave electronics and optoelectronics, including but not limited to cutting-edge GaN, GaAs, InGaAs, InP, AlN, diamond, etc semiconductor technologies that potentially can be heterogeneously integrated with stable laser systems.

Description

The goal is to develop integrated photonic-electronic-quantum systems for laser metrology in future large space telescopes, high-speed and secure space communications, sensing, power transfer, and similar missions.

Field of Science

Technology Development

Advisors

Not specified

Requirements

• U.S. Citizenship or U.S. Lawful Permanent Resident (LPR)
• Foreign Nationals eligible for an Exchange Visitor J-1 visa status
• Applicants for LPR, asylees, or refugees in the U.S. at the time of application with 1) a valid EAD card and 2) I-485 or I-589 forms in pending status
• Hold a PhD in Physics, Photonics, Quantum, Electrical/Mechanical Engineering, or relevant to the above technological areas
• Familiarity with a few or more of the following analytical and experimental tools and processes: UV/e-beam lithography, UV imprint, Thermal/E-beam evaporation, Vapor Deposition, Reactive ion/ICP etching, dry/wet etching, Annealing, Poling, SEM, AFM, Nanophotonic design software, Comsol, Ansys, Cadence/Siemens Rf/Microwave EDA, Zemax, Optical Spectrum Analyzer, fiber splicer, RF/DC instruments, laser spectroscopy, Fabry-Perot cavity/delay-line characterization, on-chip waveguide characterization, thermal-mechanical stress analysis, Rf/Microwave load-pull, monolithic-microwave IC design, analog-digital hybrid IC design, chip-bonding and packaging physics and chemistry processes, etc.

Qualifications

Successful candidates should hold a PhD in Physics, Photonics, Quantum, Electrical/Mechanical Engineering, or relevant to the above technological areas and should be familiar with a few or more of the following analytical and experimental tools and processes: UV/e-beam lithography, UV imprint, Thermal/E-beam evaporation, Vapor Deposition, Reactive ion/ICP etching, dry/wet etching, Annealing, Poling, SEM, AFM, Nanophotonic design software, Comsol, Ansys, Cadence/Siemens Rf/Microwave EDA, Zemax, Optical Spectrum Analyzer, fiber splicer, RF/DC instruments, laser spectroscopy, Fabry-Perot cavity/delay-line characterization, on-chip waveguide characterization, thermal-mechanical stress analysis, Rf/Microwave load-pull, monolithic-microwave IC design, analog-digital hybrid IC design, chip-bonding and packaging physics and chemistry processes, etc.