III-V Device Engineer

About the role

Company overview: Skorpios Technologies, Inc. are innovators in heterogeneous integration of silicon photonic technology and semiconductor development. The company is rapidly expanding the technical organization and seeking Sr. Simulation Engineers specializing in Optical and Photonics modeling. These roles are critical in developing the next generation of disruptive III-V and Silicon Photonics integrated products.

Job purpose: The Sr. Simulation Engineer is responsible for high-fidelity modeling and simulation of complex photonic integrated circuits (PICs). You will lead the virtual prototyping of high-performance devices—including lasers, modulators, and passive optical components—ensuring designs are optimized for Skorpios’ unique technology platform. Operating with an in-house foundry, these roles serve as the essential bridge between theoretical physics and rapid hardware implementation.

Responsibilities

• Material & Heterogeneous Integration: Optimize epitaxy layers and quantum well designs. Perform optical mode and impedance matching across diverse material interfaces to ensure seamless III-V and Silicon integration.
• In-House Foundry Collaboration: Partner directly with the internal Fab and Device Designers to translate simulations into actionable layouts. Establish process design rules and perform DRC (Design Rule Check) and LVS (Layout Versus Schematic) to ensure tapeout accuracy.
• Virtual DOE & Validation: Execute virtual Design of Experiments (DOE) to predict device reliability and performance. Validate simulation outputs against internal lab characterization data to refine material parameters and "close the loop" on model accuracy.

Requirements

• Technical Stack & Knowledge Domains:
  • RF & Mathematical Tools: Experience with Keysight ADS, Ansys HFSS, or CST Microwave Studio.
  • Advanced proficiency in Python or MATLAB for automation and large-scale data analysis.
  • III-V & Semiconductor Physics: Deep understanding of bandgap engineering, carrier dynamics, recombination mechanisms, and band structures.
  • Fabrication & Packaging: Strong knowledge of how epitaxy growth, etching profiles, and metalization affect optical modes. Familiarity with fiber coupling and Co-Packaged Optics (CPO).
• Competencies:
  • Analytical Thinking: Ability to synthesize large datasets and utilize statistical tools (e.g., JMP or Minitab) for performance reporting.
  • Communication: Proven ability to present complex technical trade-offs to engineering teams, executive leadership, and customers.
  • Problem Solving: Strong troubleshooting skills in resolving discrepancies