IC Package Engineer (Starlink/Akoustis)

Responsibilities

• Design, develop, and qualify IC packaging technologies including flip-chip, wire bonding, wafer-level packaging (WLP), QFN, CSP, and LGA
• Evaluate and select packaging materials (substrates, mold compounds, underfills, adhesives) based on thermal, mechanical, and electrical properties
• Drive thermal management strategies within packages, including simulation and implementation of heat dissipation techniques
• Define and execute reliability test plans (e.g., thermal cycling, uHAST, HTOL) for qualification of package designs
• Utilize EDA/CAD tools (e.g., AutoCAD) for mechanical layout, with experience in ANSYS or other simulation tools as a plus
• Apply DFM methodologies to ensure manufacturability, reliability, and testability from concept through production
• Provide technical guidance for IC assembly and packaging processes, including SMT, die attach, reflow, wire bonding, underfill, and encapsulation
• Conduct and support failure analysis investigations using tools like X-ray, SEM, FIB, and cross-sectioning to drive root cause and corrective actions
• Perform root cause analysis and data-driven troubleshooting using tools such as FMEA, SPC, and Six Sigma methodologies
• Collaborate with PCB and substrate design teams to ensure co-design compatibility and package-board integration
• Own project timelines, risks, and deliverables related to packaging initiatives and report progress to key stakeholders

Basic Qualifications

• Bachelor’s degree in mechanical Engineering, packaging Engineering, materials science, electrical Engineering, or other engineering discipline
• 1+ year of experience designing, qualifying, or implementing IC packaging solutions (internships and academic projects are applicable)

PREFERRED QUALIFICATIONS

• 2+ years of hands-on experience with semiconductor packaging technologies, including:
• Flip-chip, wire bond, WLP, LGA, CSP, QFN
• Organic/inorganic substrates and PCB manufacturing
• Deep understanding of packaging materials and their thermal, mechanical, and electrical properties
• Familiarity with thermal management techniques for power-dense or mission-critical electronics
• Experience with reliability testing, including JEDEC and IPC standards (e.g., thermal cycling, uHAST, HTS, vibration)
• Knowledge of assembly processes: SMT, die attach, reflow soldering, encapsulation, underfill, etc.
• Strong analytical skills with expertise in:
• Root Cause Analysis
• Statistical Process Control (SPC)
• Six Sigma / Lean tools
• Failure Mode and Effects Analysis (FMEA)
• Experience with EDA/CAD tools such as AutoCAD (required); ANSYS or COMSOL (a plus)
• Proven ability to lead cross-functional efforts across design, reliability, manufacturing, and supply chain
• Strong project management, organizational, and communication skills