Silicon Packaging Process Engineer, Production (Starlink)

Responsibilities

• Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems
• Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, surface mount technology (SMT), flip chip, bonding, molding, underfill, dispense, sputter, lid attach, solder ball attach, and advanced packaging processes
• Own packaging prototypes, product development, release to production, and process sustainment in a high-volume production environment
• Develop, document, implement, and monitor Out of Control Action Plan (OCAP), Statistical Process Control (SPC) and defect yield paretos to drive continuous improvement
• Cross-functional interface with silicon design, materials, thermal, systems, and production teams
• Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond
• Troubleshoot equipment malfunctions, analyze process drifts, and perform root cause investigations to minimize defects and enhance operational excellence
• Document process data, prepare reports on key metrics, and contribute to design of experiments (DOE) for process enhancements
• Assist in tool installations, preventive maintenance, and qualification testing to support high-volume production and rapid prototyping
• Provide detailed documentation of procedural steps and training aids for team of production specialists, technicians, and associates
• monitor adherence to protocols and provide individual remediation as necessary

BASIC QUALIFICATIONS

• Bachelor’s degree in an engineering, math, or science discipline
• 1+ years of experience in a manufacturing environment via professional work experience, project/research-based student experience, or a combination of both

PREFERRED SKILLS AND EXPERIENCE

• Bachelor's degree in materials science, mechanical engineering, electrical engineering, chemical engineering, or a related field
• 3+ years of practical experience in semiconductor manufacturing processes in a fab setting
• Proficiency in data analysis and process control software (e.g., JMP, SQL) for statistical process control (SPC) and trend analysis
• Experience in New Product Integration (NPI) activities, First Article Verification Processes (FAIR), and scaling into High Volume Manufacturing (HVM) as part of cross-functional teams