Silicon Packaging Technician, Silicon Assembly (Starlink)

Responsibilities

• Operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals & dielectrics as well as stripping and etching equipment
• Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy
• Maintain process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control
• Operate dicing saws, laser dicers, and plasma etching tools to perform mechanical, laser, or plasma-based singulation on wafers and large-format panels, following & monitoring recipes
• Load and unload materials into molding systems, following recipes to achieve target mold fill, void minimization, and flash control during production runs
• Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness
• Operate electrochemical plating tools, including copper electroplaters and seed layer systems, and stripping/etch equipment to process products according to recipes for uniform deposition and precise material removal rates.
• Comply with cleanroom gowning protocols (ISO), Chemical Safety Standards, & Strict Electrostatic Discharge (ESD) guidelines

BASIC QUALIFICATIONS

• A high school diploma or equivalency certificate
• 3+ years of professional experience in a hands-on manufacturing environment; OR an associate's degree in an engineering, math or science discipline

PREFERRED SKILLS AND EXPERIENCE

• A bachelor's degree in materials science, electrical engineering, or a related field
• 6+ years of practical experience in high volume semiconductor manufacturing operations
• Proficiency and experience in photolithography (e.g. align, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging
• Proficiency in data analysis and process control software for statistical process control (SPC)
• Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates
• Experience with metrology tools such as confocal scanning acoustic microscopy(C-SAM), 3D profilometers, stereoscopes, optical tensiometers (goniometer), X-Ray fluorescence (XRF)
• Excellent manual dexterity with the ability to work with both hands under a microscope

ADDITIONAL REQUIREMENTS

• Must be able to work all shifts & be willing to work overtime and/or weekends as needed
• Must be able to dawn & wear (at all times) cleanroom attire (e.g. bouffant caps, gowns, masks, nitrile gloves, ESD footwear, bunny suits, hoods) for full shifts
• Standing for long periods, bending, grasping, sitting, pulling, pushing, stooping & stretching
• Must be able to lift up to 35lbs. unassisted

ITAR REQUIREMENTS

• To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.

SpaceX is an Equal Opportunity Employer; employment with SpaceX is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.