High Speed Photonic Integrated Circuit Designer

RESPONSIBILITIES

• Design, simulate, and optimize high-speed electro-optic modulators and integrated photonic circuits across silicon photonics and III–V platforms (e.g., InP/InGaAsP), with applications spanning advanced coherent and IM/DD transmitters
• Drive photonic tape-outs end-to-end, including circuit design, DOE planning, hands-on layout, foundry interfacing, and coordination with packaging and electronic driver stakeholders
• Own device, circuit, and system modeling workflows using industry tools (e.g., Lumerical Mode/FDTD/Interconnect, BeamPROP, HFSS, ADS/Ansys Designer, VPI), and develop models that incorporate process variation and fab non-idealities
• Lead RF, signal integrity, and high-speed interconnect design from die to carrier/package/PCB, including co-design of chip, carrier, RF package, and chip-on-carrier interconnects; identify and resolve signal integrity issues across the link
• Partner with driver and packaging teams/suppliers to optimize end-to-end modulator + driver performance, including impedance matching, bandwidth, voltage swing, and power/thermal constraints
• Define design-for-test strategies and collaborate with test and assembly teams to plan and execute automated, high-volume characterization and assembly-level validation; develop new test methods as needed
• Analyze measurement results (e.g., EO S-parameters/S21, eye diagrams, mask margin, RIN, chirp) and correlate test and physical data (including SEM/fab feedback) to models to drive root-cause analysis and performance improvement

QUALIFICATIONS

• Master’s or PhD in electrical engineering, applied physics, optical engineering, or a related discipline
• 3+ years of industrial experience in integrated photonics, including design and modeling of passive and active components with emphasis on electro-optic phase shifters/modulators
• Demonstrated experience designing high-speed photonic devices (10+ GHz bandwidth and beyond preferred) and understanding key transmitter architectures (e.g., PAM4, coherent formats)
• Proficiency with photonic simulation tools (e.g., Ansys Lumerical; COMSOL, Tidy3D/Meep, or similar) and familiarity with photonic circuit modeling (e.g., Interconnect/SAX or equivalent)
• Working knowledge of RF fundamentals and signal integrity; experience with EM/SI simulation tools (e.g., HFSS, ADS, Ansys Designer)
• Phtonic layout and tapeout experience (e.g., IPKISS, GDSFactory, or similar) and understanding of foundry processes and design rules
• Strong programming and data analysis skills (e.g., Python and/or MATLAB) for automation, visualization, and data-driven design decisions
• Strong communication skills and ability to work independently in a fast-moving, cross-functional team
• Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

• Deep expertise in high-bandwidth, low-voltage modulator design across material systems (e.g., doped silicon, thin-film lithium niobate, BTO, InP/GaAs/AlGaAs/InGaAsP), including large-signal behavior and practical transmitter integration
• Experience with chip-to-package co-design: chip-on-carrier/RF packaging, high-speed interconnect design, and PCB-to-package SI closure
• Experience correlating models to characterization and physical metrology (e.g., wafer/process variation modeling, SEM correlation, fab issue root-cause)
• Familiarity with high-speed characterization methods and test metrics (e.g., S-parameters, time-domain large-signal measurements, eye/mask, RIN, chirp) and experience defining testability and automated test strategies
• Experience collaborating directly with driver vendors or internal driver teams to optimize combined driver–modulator performance
• Understanding and/or hands-on experience with photonic packaging and photonic–electronic interfaces (drivers, TIAs, etc.)
• Experience with system-level simulation for optical links and transmitters (e.g., VPI, ADS, Interconnect)