Photonic Integrated Circuit Designer

Responsibilities

• Design, analyze, and simulate Photonic Integrated Circuit (PIC) building blocks (e.g., Mach–Zehnder modulators, photodiodes, DWDM filters, waveguides, couplers/splitters, tapers, and switches) on silicon photonics and InGaAs/InP platforms
• Define requirements and specifications for PICs and their optical/electrical interfaces
• Design and model package-level optical interfaces, including edge and grating couplers
• Work with DSP, electro-optics, ASIC, and other engineering teams to define system functions across hardware and software
• Perform PIC routing and layout
• Measure and characterize PIC optical and electrical building blocks
• Develop and automate test solutions for lab validation, quality screening, and manufacturing metrology
• Partner with manufacturing and test teams on production test development and qualification of PICs
• Use simulation tools (e.g., Lumerical, Klayout, COMSOL, HFSS) to support design and verification
• Contribute to RF, analog, and mixed-signal design efforts as needed
• Interface with suppliers to provide technical feedback and test requirements to develop reliable processes

Qualifications

• Master’s degree in electrical engineering, computer engineering, optical engineering, or applied physics
• 2+ years of experience in photonics or electro-optical IC design
• Hands-on familiarity with optical/RF test equipment (e.g., spectrum analyzers, VNAs, VSGs, high-speed oscilloscopes, BERTs)
• Willingness to work extended hours and weekends as needed

PREFERRED EXPERIENCE

• PhD in electrical engineering, computer engineering (electro-optics emphasis), optical engineering, or applied physics
• Experience with electrical simulation tools (e.g., SPICE)
• Familiarity with DSP concepts (e.g., FFE, DFE, CTLE) and optical communications metrics (e.g., OSNR, receiver sensitivity, OMA, optical filtering)
• Strong circuit design and analysis skills across linear and non-linear blocks (e.g., modulator drivers, TIAs, CTLEs, filters, LNAs/PAs)
• Experience designing wideband circuits for >100 Gb/s SerDes links with bandwidths in the tens of GHz
• Familiarity with high-speed modulation formats and link protocols (e.g., NRZ, PAM4)
• Experience designing RF/DC probe-card PCBs
• Experience characterizing PIC/EIC performance for high-speed optical SerDes systems