Principal High-Speed Photonics Design Engineer

About the role

The Principal High-Speed Photonics Design Engineer will lead the design and optimization of high-speed III-V-based optical modulators and detectors, collaborating with PIC architects, high-speed systems, reliability, fabrication and packaging engineers to bring photonic integrated circuit (PIC) based products to market.

Responsibilities

• Design and optimize high-speed III-V-based optical modulators and detectors, including EAM and Mach-Zehnder Interferometers (MZIs), IIIV pin and UTC detectors, using industry-standard photonics design tools
• Analyze experimental results, compare them with simulations, and refine device designs and generate compact models for OpenLight PDK
• Publish and maintain equivalent circuit models and generate design documentation for high-speed photonic devices for OpenLight PDK documents and models
• Collaborate with layout and fabrication teams to define mask-layouts and process flows to fabricate photonic devices
• Work closely with system engineers to integrate modulators into high-speed system validation hardware
• Support test engineers with high-speed device test development and characterization
• Stay up-to-date with advancements and industry trends in Silicon photonics and III-V high-speed modulators, detectors and optical interconnect hardware
• Publish in technical journals, conferences, and submit novel ideas for patent generation to contribute to the company’s innovation portfolio

Requirements

• PhD in Electrical Engineering, Materials, Physics, or a related field
• Minimum 10+ years of industry experience designing Si-Ge and/or IIIV high-speed modulators and detectors for transceiver products
• Strong background in semiconductor high-speed device physics in Si-Ge and/or III-V material
• Hands-on experience with high-speed device simulations and circuit design tools (e.g Ansys HFSS, CST, ADS, Sentaurus TCAD, Crosslight)
• Experience with RF characterization of photonic devices (transceiver modules is a plus)
• Knowledge of relevant semiconductor fabrication processes
• Strong analytical and problem-solving skills with the ability to work in a fast-paced, collaborative environment

Qualifications

• Excellent written and verbal communication skills for technical documentation and reporting

Skills

• Deep knowledge of III-V opto-electronic high-speed device theory
• Proven track-record in bringing photonic integrated circuit (PIC) based products to market

Benefits

• Competitive salary range: USD 225,000-305,000 / year
• Hybrid work schedule
• Flexible work location options: Goleta, California, United States; Santa Clara, California, United States

Pay

• USD 225,000-305,000 / year

Schedule

• Hybrid work schedule

Location

• Goleta, California, United States
• Santa Clara, California, United States