High-Speed Interconnect Architect

About the role

NVIDIA is looking for a curious and driven Junior Interconnect Engineer to join our High-Speed Interconnect team onsite in Santa Clara, CA. This is a great opportunity to develop deep expertise in high-speed cable and connector engineering (≥100Gbps per lane) alongside some of the best engineers in the industry. You'll contribute to real product development while growing your skills across electrical and mechanical domains.

Responsibilities

• Support the development and documentation of product requirements for high-speed cables and connectors
• Collaborate with senior engineers and cross-functional teams to understand customer needs and translate them into design inputs
• Assist in mechanical and signal integrity analysis, learning to navigate the tradeoffs between the two
• Participate in root cause analysis for mating and mechanical issues, and help refine designs for manufacturability and reliability
• Support prototyping efforts and help track progress through development cycles
• Work closely with vendors and internal R&D teams under the guidance of senior architects
• Occasional travel to vendors, manufacturers, or customer sites (~10%) to build hands-on experience

Requirements

• B.S. in Electrical Engineering or Mechanical Engineering (or a related field) or equivalent experience
• 2+ years of experience in hardware engineering, with exposure to connectors, cables, or high-speed signal design
• Basic understanding of signal integrity or mechanical design principles — you don't need to be an expert in both, but curiosity across both domains is a must
• Ability to collaborate effectively with cross-functional teams and communicate technical ideas clearly
• Eagerness to learn, ask questions, and grow quickly in a fast-paced environment

Preferred qualifications

• Any coursework or hands-on experience with high-speed PCB design, signal integrity, or connector mechanics
• Familiarity with engineering tools such as FEA, thermal modeling, or lab measurement equipment
• Side projects, internships, or research involving hardware prototyping or manufacturing
• Genuine enthusiasm for how physical interconnects enable next-generation computing

Compensation

Base salary range: 124,000 USD - 195,500 USD for Level 2, and 152,000 USD - 241,500 USD for Level 3, plus equity and benefits.