Hardware Engineer, High Speed Digital Engineer

Amazon LEO is an initiative to increase global broadband access through a constellation of 3,236 satellites in low Earth orbit (LEO). Its mission is to bring fast, affordable broadband to unserved and underserved communities around the world. Amazon LEO will help close the digital divide by delivering fast, affordable broadband to a wide range of customers, including consumers, businesses, government agencies, and other organizations operating in places without reliable connectivity.

Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Responsibilities

• Select and qualify high-speed interface components (connectors, retimers, PHYs, ESD protection) balancing performance, cost, availability, and manufacturability
• Own schematic capture for high-speed digital subsystems — define net topologies, termination schemes, and interface pin assignments in collaboration with PCB layout engineers
• Own signal integrity analysis for high-speed interfaces (DDR, PCIe, Ethernet, USB, MIPI) from architecture through production, including simulation, design rule development, lab validation, and correlation
• Perform channel modeling and simulation using EM tools (ANSYS HFSS/SIwave, Keysight ADS, Cadence Sigrity, Hyperlynx) to verify interconnect performance meets silicon requirements
• Participate in schematic and layout design reviews, providing signal and power integrity feedback to ensure designs meet performance and cost targets
• Validate high-speed interfaces in the lab using oscilloscopes, VNAs, TDRs, and high-fidelity probing techniques. Correlate measurements back to simulation models
• Collaborate with silicon, RF, antenna, thermal, mechanical, power, and systems teams to close budgets and solve problems within real-world product constraints
• Support board bring-up, debug, and root-cause analysis of SI/PI-related failures
• Support designs through qualification, production ramp, and high-volume manufacturing

Requirements

• Bachelor's degree in Electrical Engineering or a related field
• Knowledge of CAD software like Orcad and Allegro
• 3+ years of experience in high-speed digital interface design and/or Signal Integrity simulation/validation

Qualifications

• Master's degree in Electrical Engineering or a related field
• Experience designing cost-optimized, high-volume consumer electronics
• Experience with Power Distribution Network (PDN) design, simulation, and validation
• Experience with SI/PI co-simulation for mixed-signal applications
• Experience working with interdisciplinary teams to execute product design from concept to production

Pay

USA, WA, Redmond - $136,000.00 - $184,000.00 USD annually

Benefits

• Sign-on payments and restricted stock units (RSUs)
• Health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans)
• Employee Assistance Program (EAP) and Mental Health Support
• Medical Advice Line
• Flexible Spending Accounts
• Adoption and Surrogacy Reimbursement coverage
• 401(k) matching
• Paid time off
• Parental leave