Hardware and Systems Developer Intern 2027 -Rochester, MN

About the role

IBM Hardware and Systems engineers design and deliver the compute platforms that power the world’s most advanced AI, cloud, and enterprise technologies. From silicon to system, our teams collaborate across mechanical, electrical, computer, materials, and firmware engineering to design, prototype, and test next-generation IBM hardware. We are seeking Hardware and Systems Development Interns to join our U.S. development labs for 2026. These roles provide hands-on experience in design, prototyping, testing, and process development across IBM’s high-performance systems portfolio.

Responsibilities

• Collaborate across disciplines to design, model, and validate next-generation hardware and systems.
• Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools.
• Participate in PCB layout, power and signal integrity, circuit design, firmware development, and system bring-up.
• Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects.
• Write scripts and automation tools using Python, C/C++, or Bash to support testing and validation.
• Opportunities to work in focus areas such as:
  • Mechanical & Thermal Design – SolidWorks, CFD, FEM, design for manufacturing, and reliability testing.
  • Electrical & Logic Design – PCB/IC layout (Cadence, Allegro), digital logic, circuit, and system design.
  • Optics & Photonics – Fiber optics, photonics, lasers (DFB, VCSEL), optical networking, and data center systems.
  • Firmware & Automation – Embedded systems, firmware testing, scripting, and hardware debugging.
  • Materials & Process Engineering – Composites, metallurgy, heat transfer, and process development.

Qualifications

B.S. or M.S. student in Mechanical, Electrical, Materials, Chemical, Industrial, or related Engineering disciplines. Strong