Hardware and Systems Developer Intern 2027 -New York

Your Role And Responsibilities

As an intern, you will:

• Collaborate across disciplines to design, model, and validate next-generation hardware.
• Support mechanical, thermal, electrical, optical, and logic design using CAD, EDA, and simulation tools.
• Participate in PCB layout, power and signal integrity, circuit design, and system bring-up.
• Conduct experiments, analyze data, and contribute to reliability, process, and materials development projects.
• Write scripts and automation tools using Python, C/C++, or Bash to support testing and validation.

You'll have opportunities to work in focus areas such as:

• Mechanical & Thermal Design – SolidWorks, CFD, FEM, design for manufacturing, and reliability testing.
• Electrical & Logic Design – PCB/IC layout (Cadence, Allegro), digital logic, circuit, and system design.
• Optics & Photonics – Fiber optics, photonics, lasers (DFB, VCSEL), optical networking, and data center systems.
• Materials & Process Engineering – Composites, metallurgy, heat transfer, and process development.

Required Technical And Professional Expertise

• B.S. or M.S. student in Mechanical, Electrical, Materials, Chemical, Industrial, or related Engineering disciplines.
• Strong academic background with an interest in hardware design, optics, logic, process, or materials engineering.
• Experience with CAD tools (SolidWorks, AutoCAD, Allegro, Cadence) and/or simulation tools (CFD, FEM, HFSS).
• Programming experience with Python, C/C++, or Bash for automation or data analysis.
• Strong analytical, problem-solving, and teamwork skills.

Preferred Technical And Professional Experience

• Experience with test automation.
• Hands-on experience with lab tools (LabVIEW, MATLAB, oscilloscopes, thermal chambers, or optical test equipment).
• Familiarity with design of experiments (DOE) or project management in a research or lab environment.
• Experience in signal or power integrity modeling, optical systems, logic design, or materials process engineering.
• M.S. or Ph.D. students with a research focus in electrical packaging, photonics, signal integrity, or thermal design are encouraged to apply.