Field Application Engineer - Power Interconnect

Amphenol Industrial Operations specializes in high-reliability power and signal connectors for harsh environments and high-performance applications, serving sectors like AI data centers, energy storage, and electric vehicles.

About the role

The Field Application Engineer (FAE) - Power Interconnects will provide technical support and application expertise across North America for Amphenol's power-to-board and power-to-rack connector solutions and liquid cooling used in AI server, data center, and high-performance computing (HPC) applications. This role serves as a key technical interface between customers, sales, and product development teams, ensuring Amphenol's interconnect technologies meet the evolving power distribution needs of next-generation AI architectures.

Responsibilities

• Support AI and data center customers in the design, development, and integration of Amphenol power connector solutions into rack, server, and board-level systems.
• Translate customer specifications and requirements into interconnect designs, collaborating closely with internal engineering and manufacturing teams.
• Provide technical leadership in power delivery standards and participate in relevant working groups (e.g., OCP, ODCC, or hyperscaler-specific initiatives).
• Drive innovation in connector technologies for high-current, low-resistance, and high-reliability applications.
• Partner with sales and business development to provide technical insight during design-in and qualification phases.
• Conduct field validation, performance testing, and troubleshooting at customer sites or Amphenol labs.
• Act as the voice of the customer to inform future product roadmap and technology direction.
• Maintain up-to-date awareness of AI hardware trends, including rack density, power efficiency, and modular architecture developments.

Requirements

• Bachelor's degree in Electrical, Mechanical, or Mechatronic Engineering (Master's preferred).
• 3-7 years of experience in connector design, power electronics, or related hardware integration roles.
• Experience in AI data centers, rack power distribution, cooling systems, or server platform engineering strongly preferred.
• Customer-facing or field engineering experience required.
• Prior involvement with industry standards or consortiums (OCP, PCIe, or similar) a plus.
• Familiarity with AI compute racks, GPU servers, and power delivery architectures (e.g., 48V, blind-mate power, busbars) highly desirable.
• Ability to travel domestically and internationally up to 50%, with significant travel in the Bay Area (CA).

Skills

• Deep technical understanding of power electronics, high-current interconnects, and thermal management.
• Proficiency in electrical and mechanical CAD tools (e.g., Creo, SolidWorks, AutoCAD).
• Working knowledge of electrical performance metrics such as current carrying capacity, contact resistance, derating, and impedance.
• Ability to interpret electrical schematics, 3D models, and mechanical drawings.
• Strong interpersonal, presentation, and communication skills for customer and cross-functional engagement.
• Proficiency with Microsoft Office.
• Proficiency in engineering simulation tools (e.g., ANSYS, SPICE, or equivalent) is a plus.
• Ability to speak Mandarin highly desired.

Location

Position is based in or near the Bay Area, California. Preference for candidates with experience from data center companies focused on hardware.

Physical/Environmental Requirements

• Regularly required to talk, hear, sit, stand, walk, and use hands to handle or feel.
• Must be able to sit and/or stand for long periods of time.
• Ability to work in labs, at customer sites, and with hands-on equipment.
• Occasional lifting of samples/equipment (up to 50 lbs).