EUV Mask BEOL R&D Engineer

About the role

Our Mask Technology Center (MTC) team is at the forefront of High‑NA EUV innovation. We work on the industry’s toughest lithography and mask challenges and collaborate across fields to define what next‑generation DRAM manufacturing will look like. We take on complex physics, new materials, and advanced inspection technologies—and we have fun doing it! In this role, you will develop EUV mask BEOL technologies that enable Micron’s future roadmap. You’ll own high‑visibility R&D programs, partner closely with suppliers, guide technology choices, and drive readiness for High‑NA EUV manufacturing. This is a hands‑on, high‑impact role for someone who enjoys deep technical exploration, modeling, and mentoring others while shaping long‑term strategy.

Responsibilities

• Member of a R&D team for EUV mask BEOL characterization, quality enablement, defect printability rules, and imaging performance
• Develop actinic inspection, automated defect classification, printability assessment, metrology, and defect repair processes
• Drive physics‑based modeling and lithography simulation to correlate mask properties with wafer performance
• Define tool capability requirements, lead early supplier engagement, and guide technology selection
• Work with engineers and transition developed technologies to BEOL process engineering teams

Minimum Qualifications

• MS or PhD in Materials Science, Physics, Chemistry, Chemical engineering, or a related technical field
• 2+ years of experience in semiconductor manufacturing, process development, or equivalent academic research in semiconductor technologies

Preferred Qualifications

• Experience in semiconductor mask, lithography, or wafer fabrication (EUV/DUV, advanced nodes)
• Knowledge of actinic mask inspection, defect printability, or mask repair
• Background in BEOL/FEOL process control, mask qualification, or high‑volume manufacturing
• Experience defining tool requirements, specifications, and technology roadmaps
• Track record collaborating with equipment suppliers on early-stage tool/process development
• Hands-on experience with EUV or High‑NA mask/wafer technologies
• Strong understanding of lithography fundamentals, including EUV systems and pattern transfer fidelity
• Experience with lithography simulation, OPC, or advanced mask design
• Familiarity with yield, defectivity, and process integration challenges
• Ability to lead complex R&D efforts and collaborate across fabs, suppliers, and vendors

Benefits

• Choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program and paid holidays