Engineering Specialist - Front End Days

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across diverse end markets, including Data Centers, Telecommunications, Industrial, and Aerospace and Defense. We develop innovative technologies and products across RF, microwave, millimeter wave, photonics, and high-speed analog technologies. Our solutions support critical network infrastructure applications such as artificial intelligence, high-performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement, and advanced wireless networks. With over 75 years of expertise, MACOM partners with customers to deliver semiconductor solutions at the forefront of power, frequency, and data rates.

About the role

The Shift Engineering Specialist position is an entry point into MACOM, offering hands-on technical experience and opportunities to work closely with engineering teams. This role provides exposure to semiconductor fabrication tools, processes, and problem-solving skills, with potential pathways to future engineering and technical career advancement.

Responsibilities

• Perform a variety of functions in the production of semiconductor devices in a cleanroom environment.
• Set up, operate, load, and monitor specialized equipment to ensure quality product is produced.
• Monitor equipment operation, inspect final product, clean the work environment, and perform data entry.
• Provide technical support to wafer fab operations and drive improvements in safety, quality, and output.
• Work across process technologies such as thin films, photolithography, diffusion/implant, metrology, and wet/dry etch.
• Work on a 12-hour compressed workweek shift (5:00 AM to 5:00 PM or 5:00 PM to 5:00 AM), alternating between 3 shifts one week (36 hours) and 4 shifts the following week (48 hours). Shifts rotate between Sun/Mon/Tue or Thu/Fri/Sat, with alternating Wednesdays off.
• Required to wear a cleanroom suit and/or proper safety personal protective equipment.

Requirements

• Bachelor’s degree in Engineering, Material Science, or Physics; Master’s degree preferred.
• 0–3 years of process development and manufacturing experience in thin film processing, including hands-on experience with FIB, RIE, RIE/ICP/CAIBE, PECVD, IBE, and SEM/FIB.
• Strong analytical capacity and diagnostic ability.
• Proficiency with tools like Python, SQL, or JMP for tracking manufacturing yields and analyzing process variations.
• Ability to sit or stand for 12 hours at a time.
• Strong communication skills, both written and oral.
• Great work ethic and willingness to work in a structured production environment.
• Ability to multi-task with a detail-oriented approach.

Due to ITAR regulations, only U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Benefits

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.
• Eligibility for restricted stock unit (RSU) awards and cash bonuses, subject to individual and company performance.

Pay

The hourly range for this position is $37.00 – $50.00 per hour. Actual salary offered will depend on factors such as work location, relevant experience, education, and specific knowledge, skills, and abilities.

Schedule

• 12-hour compressed workweek shifts (5:00 AM to 5:00 PM or 5:00 PM to 5:00 AM).
• Alternates between 3 shifts one week (36 hours) and 4 shifts the following week (48 hours).
• Shifts rotate between Sun/Mon/Tue or Thu/Fri/Sat, with alternating Wednesdays off.