ElectroMechanical Packaging Engineer (Hardware Protection Focus)

About the role

Lockheed Martin Missiles and Fire Control (MFC) is seeking a Staff Electromechanical Design Engineer to serve as a technical authority and hardware lead within our electromechanical engineering organization, specializing in 3D Heterogeneous Integration (3DHI). MFC is a recognized designer, developer, and manufacturer of precision engagement aerospace and defense systems for the U.S. and allied militaries.

This role is suited for an experienced electromechanical professional who can drive technical strategy, lead IPT efforts, mentor engineers, and ensure mission-critical hardware meets the highest standards of reliability and performance.

Responsibilities

• Microelectronics hardware development engineer with ownership of package hardware design, heat transfer and thermal dissipation, structural integrity and mechanical survivability of completed 3DHI packages throughout their operational lifespans.
• Design multichip package devices, including package substrates, Integrated Heat Spreaders and attach mechanism, stiffeners, and complex thermal management system integration to manage high thermal dissipation requirements.
• Collaborate with mechanical and electrical engineering analysts to develop advanced Finite Element Analysis (FEA) to perform Multiphysics models and simulations for thermal cycling and reliability, power integrity and electrical performance, and mechanical stress including operation shock and vibration.
• Define and execute packaging qualification plans adhering to project requirements, JEDEC and MIL-SPEC standardizations (e.g., Highly Accelerated Stress Testing / HAST).
• Investigate and perform failure analysis loops on critical component interface and intermetallic connections including anomalies like cracked solder joints, delaminated layers, and warped package substrates.
• Implement corrective actions to mitigate identified failure modes in manufacturing and incorporate findings into product revisions while capturing lessons learned for future development activity.
• Architect, design, and validate advanced circuit card packages.
• Design high-density circuit cards, cable assemblies, and interconnect solutions that meet size, weight, power, security, and performance constraints.
• Design and develop electromechanical systems for advanced programs, special programs, and IRAD programs, including printed wiring boards, circuit/electronic card assemblies, harness assemblies, and sub-assemblies.
• Lead and document design assurance reviews, track issues, and drive corrective actions to closure.
• Perform thermal, signal integrity, and electromagnetic compatibility analyses to ensure robust operation in harsh DoD environments.
• Coordinate with cross-functional teams — systems, hardware, software, test, and supply chain — to deliver high-quality results on schedule and within budget.
• Manage risk, schedule, and earned value metrics, and report status to senior leadership.
• Set clear technical direction for program engineers based on customer requests and program goals.
• Mentor and develop engineers, fostering an inclusive environment and driving continuous improvement initiatives.
• Communicate technical status, risks, and recommendations clearly to internal stakeholders and external customers.

Requirements

• Bachelor of Science degree in Electrical Engineering, Mechanical Engineering, or a closely related STEM field from an accredited university; Master’s degree or PhD preferred or minimum 15 years of professional experience in Electromechanical Engineering or related discipline without a degree.
• 3D Heterogeneous Integration (3DHI) Advanced Packaging technical or project leadership experience supporting the production of high-reliability electronics products.
• Microelectronics design proficiency.
• Proficient in CREO modeling and electromechanical system design.
• Project leadership/management experience throughout the engineering/production lifecycle: scoping, sizing, cost estimation, planning, scheduling, staffing, tracking, and earned value management (EVM).
• Experience in presentation, oral and written communication to facilitate effective and efficient interchanges between co-workers, leaders, and customers.
• Experience working with cross-functional teams across multiple locations.
• Experience capturing flowed and derived requirements for electromechanical designs.
• Must be a US Citizen; must possess or be able to obtain a DoD Secret security clearance.

Skills

• Thermal Interface Materials (TIM1/TIM2), Lid Attach, Package Stiffener Rings, JEDEC Qualification, HAST, Thermo-mechanical Stress Multiphysics modeling.
• Direct experience supporting production (manufacturing and test).
• Demonstrated leadership skills and behaviors that align with Full Spectrum Leadership Imperatives.
• Preparation for and participation in major program design reviews (PDR, CDR).
• Experience troubleshooting and resolving technical issues.
• Proven understanding of electronics standards and processes.
• Proven understanding of mechanical standards and processes.
• Proven understanding of electronic packaging principles.
• Demonstrated ability to multitask and adapt to changing priorities.
• Experience with military defense hardware.
• Experience with parts and materials selections.
• Ability to perform design trade studies evaluating cost, weight, packaging, and power benefits.
• Flex circuit and microelectronics design experience.
• Active DoD Secret or Top Secret Clearance.

Pay

Full-Time Salary Range: $104,900.00 - $194,700.00.

Please note that the salary information listed is a general guideline only. Lockheed Martin considers factors such as (but not limited to) scope and responsibilities of the position, candidate's work experience, education/training, key skills as well as market (work location) and business considerations when extending an offer.

Benefits

• Medical, Dental, Vision.
• Flexible work arrangements and schedules (e.g., 4x10).
• 401(k) match.
• Paid time off, Holidays, Parental Leave.
• Employee Assistance Program (EAP).
• Flexible Spending Accounts.
• Education Assistance.
• Life Insurance, Short-Term Disability, and Long-Term Disability.
• Annual short-term and/or long-term incentive compensation programs may be offered depending on the position. Payments under these annual programs are not guaranteed and can vary from year to year and are tied to a range of performance metrics.

For (Washington state applicants only):

• Non-represented full-time employees: accrue at least 10 hours per month of Paid Time Off (PTO) to be used for incidental absences and other reasons; receive at least 90 hours for holidays.
• Represented full-time employees: accrue 6.67 hours of Vacation per month; accrue up to 52 hours of sick leave annually; receive at least 96 hours for holidays.
• PTO, Vacation, sick leave, and holiday hours are prorated based on start date during the calendar year.