Director, Package Design Engineering

About the Company

Renesas is one of the top global semiconductor companies, striving to develop a safer, healthier, greener, and smarter world. Our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure, and IoT markets. With a robust product portfolio including world-leading MCUs, SoCs, analog, and power products, we serve as a key supplier to leading electronics manufacturers worldwide. Renesas employs roughly 21,000 people in more than 30 countries and is guided by a culture rooted in transparency, agility, global collaboration, innovation, and entrepreneurship.

Responsibilities

• Lead package technology development, new product introduction (NPI), and R&D for Renesas’s AI/datacenter infrastructure power packaging, focusing on Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages.
• Drive development of wide-bandgap (WBG) technologies such as SiC and GaN, along with DBC, AMB substrates, and advanced interconnect technologies.
• Benchmark, select, and qualify materials, processes, and assembly subcontractors (OSAT) or contract manufacturers (CM).
• Collaborate with OSAT/CM to develop, run DOE, optimize processes, and establish process specifications.
• Work with product groups and reliability teams to qualify new packages and processes within required timelines.
• Resolve process integration issues by ensuring critical process steps are thoroughly validated.
• Establish production controls and monitors to prevent quality incidents.
• Ensure smooth transition into production and implement ramp-up monitoring.
• Monitor and resolve process issues early in production to guarantee superior quality parts are shipped to customers.
• Develop and maintain technical expertise on advances in power SiP/modules, wafer-level packaging, and flip-chip interconnects.
• Participate in packaging roadmap development and execution.
• Address internal and external customer complaints by collaborating with marketing, product groups, quality, and operations teams.
• Establish and maintain package design rules.
• Manage R&D budget and customer adoption programs, including global OSAT management and technology roadmap definition.

Requirements

• Doctorate, Master’s, or Bachelor’s degree in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering.
• 15 to 20 years of relevant experience in package development, with emphasis on power SiP/module, wafer-level, and flip-chip packaging.
• Strong understanding of power SiP/modules, wafer-level/flip-chip packaging methods, assembly processes, qualification methods, SPC, and statistical analysis software.
• Knowledge of wire-bonding and multi-chip module technologies is a plus.
• Strong interpersonal, communication, analytical, and presentation skills.

About Renesas

Renesas is an embedded semiconductor solution provider focused on making lives easier through technology. With a global team of over 21,000 engineers in more than 30 countries, we work on world-leading technology for automotive, industrial, infrastructure, and IoT applications. Our culture, TAGIE (Transparent, Agile, Global, Innovative, and Entrepreneurial), drives collaboration and innovation, shaping a safer, healthier, and smarter future.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to diversity and fostering an inclusive work environment free of discrimination.