Director, Package Development

About the Role

Amkor is seeking a senior Director of Advanced Packaging and Wafer Services for the Tempe, AZ office. This role will provide strategic and technical leadership for the development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, chiplet-based architectures, and other leading-edge package constructions for computing, networking, AI, and mobile market segments.

The successful candidate will serve as a senior customer-facing leader and primary interface with Tier 1 customers, Amkor's global R&D centers, and cross-functional business and engineering teams to drive technology roadmaps, program execution, and successful transition from development into production ramp.

Responsibilities

• Lead strategic customer engagements and development programs with Tier 1 customers, aligning customer requirements with Amkor's advanced packaging technology roadmap.
• Drive and coordinate development activities with Amkor's R&D teams in Korea and other global engineering organizations to ensure timely execution of advanced package programs.
• Serve as the senior technical and program interface for customer meetings, executive reviews, technical discussions, issue resolution, and follow-up actions during the development and qualification phases.
• Lead cross-functional teams across R&D, design, characterization, simulation, process engineering, product management, operations, suppliers, and business development to execute complex advanced packaging programs.
• Own customer product management through concept definition, feasibility assessment, development, qualification, and initial production ramp.
• Guide technical tradeoff decisions related to package architecture, wafer process integration, design rules, materials, reliability, manufacturability, cost, schedule, and yield risk.
• Lead key engagements with ecosystem partners and wafer processing suppliers to influence technology choices, supplier readiness, and future roadmap direction.

Requirements

• Bachelor's degree in Engineering required; Master's degree or Ph.D. preferred.
• 10+ years of experience in semiconductor package development, wafer-level packaging, IC packaging, or wafer process technology.
• Demonstrated leadership in advanced packaging development programs, including direct customer engagement with major semiconductor, computing, networking, AI, or mobile customers.
• Strong technical understanding of IC package architecture, package design environments, wafer process integration, design-rule tradeoffs, and manufacturability considerations.
• Working knowledge of IC packaging materials, failure modes, reliability qualification, process characterization, and production ramp requirements.
• Proven ability to lead cross-functional and global teams, influence technical and business stakeholders, and drive alignment across customers, engineering, operations, suppliers, and executive leadership.
• Excellent written and verbal communication skills, including the ability to present complex technical and business topics to senior customer and internal leadership.
• This position requires 10-20% domestic and international travel.

Preferred Qualifications

• Deep expertise in high-density fan-out, 2.5D integration, chiplet module architectures, bridge-like constructions, advanced substrate technologies, or heterogeneous integration.
• Experience taking advanced package technologies from concept through qualification and early production ramp.
• Familiarity with cost modeling, yield improvement, design-for-manufacturing, and technology roadmap planning.
• Experience working with global R&D teams, OSAT operations, foundries, fabless semiconductor companies, or major system customers.

Schedule

This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.