Director, Heterogenous Integration/Advance Packaging

About the role

The successful candidate will be in Santa Clara, CA as a member of a global diverse cross functional team responsible for developing new modules in Advanced Semiconductor Packaging.

Responsibilities

• Domain expertise in advanced packaging areas such as W2W/D2W bonding, micro bumps, TSV, thermal management, optics and multi-wafer stacking with deep understanding of materials, process, device physics and integration.
• Ability to drive new materials and process development to enable new inflections in logic, DRAM and NAND through structured problem-solving methodology.
• Proven track record of solving complex problems through innovation and ideation of novel approaches.
• Ability to define and develop differentiated modules by leveraging Applied’s broad portfolio of tools.
• Thought leader to define and maintain Applied’s roadmap in hybrid and fusion bonding for emerging device architectures.

Qualifications

• Minimum of MS/PhD in Electrical, Mechanical Engineering, Material Engineering or equivalent
• 10+ years of experience in advanced packaging specializing in logic, DRAM or NAND
• Strong communication skills to be effective in dealing with business units and cross-functional teams
• Proven track record of managing customer engagements (technical and business)
• Program management (PMP) certification is a plus
• Lead projects across organization and culture in a fast-paced environment
• Self-starter, team player and able to work independently with minimal supervision