Director, fcCSP Business Unit

Position Summary

Amkor is seeking a Product Manager for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This role involves managing and interacting with customers for new product development, qualification, and mass production of advanced flip chip products. It requires a combination of technical expertise, project management, strategic planning, and customer satisfaction.

Essential Duties and Responsibilities

• Daily application of detailed knowledge of semiconductor packaging assembly and substrate technologies across multiple concurrent development/NPI programs.
• Drive customer requirements and timelines to multiple Southeast Asia factories.
• Perform and analyze detailed cost modeling for product level assembly pricing.
• Identify and clear obstacles related to product design, reliability, and manufacturability issues.
• Align on technology roadmaps and drive flip chip priorities for use in consumer, compute, mobile APs, and automotive products.
• Participate in pricing and capacity expansion negotiations both internally and externally.
• Travel to customer and factories as needed.

Required Qualifications

• At least a Bachelor's Degree in Engineering (Mechanical, Chemical, Materials, Electrical) or a Master's Degree in Engineering with 10+ years of industry experience.
• Extremely organized technical Project Management experience, preferably involving off-shore factories.
• Proven ability to work independently in a matrixed organization, being self-driven and motivated to overcome obstacles.
• Ability to identify potential risks before production starts and develop backup plans or alternative assembly strategies.
• Deep knowledge of semiconductor packaging design, materials, substrates, manufacturing methods, and various flip chip package form factors.
• Excellent written and verbal communication skills.
• Frequent face-to-face and teleconference technical presentations to customers are required.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook).
• Approximately 15% domestic and 15% international travel.

Preferred Qualifications

• Hands-on manufacturing or technical experience/exposure to manufacturing floor.
• PMP certified project management.
• Experience with cost modeling, pricing, and quoting activities/products.
• Knowledge of material and package characterization data analysis, reliability test methods, and qualification procedures.
• Experience/knowledge of flip chip packaging failure analysis methods.
• Experience with Design of Experiments and Statistical Process Control (JMP).
• Previous experience in an external customer-facing role.
• Experience with public speaking (technical conferences).
• Experience with multiple advanced packaging technologies such as fcCSP, iPOP, HDFO, RDL, and 2.5D or other advanced packaging options.

Location

The position is located in Tempe, AZ. It has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate.