DIRECTOR, CHIPLETS/FCBGA BU

About the role

Amkor is seeking a Business Unit (BU) Product Management professional for Advanced Chiplets/FCBGA Packaging in Tempe, AZ. The primary focus is program management and managing key customer accounts, driving internal process development, and supporting co-development programs for customers, off-shore factories, and supplier development teams. This role involves supporting the qualification and mass production of Chiplets/FCBGA products.

Responsibilities

• Partner with BU members to achieve annual goals while managing customer relationships to grow market share.
• Promote Amkor package technologies to new and existing customers to identify potential applications, deploying the flip chip package portfolio to gain business.
• Work closely with customer teams to understand assembly, reliability, and scheduling requirements for new package configurations and product introductions, including:
  • Substrate design
  • Silicon to package interconnects
  • Product assembly material selections
  • Manufacturing process requirements
• Create detailed package/process risk assessments for manufacturability and reliability of NPIs, highlighting cost drivers and implementing mitigation plans.
• Collaborate with customer package engineering and Amkor factory engineering to characterize prototype build plans, enabling successful qualifications and robust, on-time manufacturing production ramps. This includes:
  • Designing experiments
  • Analyzing factory build data
  • Supporting root cause failure analysis investigations
  • Managing corrective action pathways to resolution
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs, providing pricing inputs to Management and Sales.
• Work with Amkor advanced product development teams on transferring new packaging technologies to production, including cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
• Foster the development of product roadmaps, marketing strategies, and business plans for continued growth in existing and emerging markets.

Requirements

• Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science, or other relevant disciplines). Master’s degree is a plus.
• 10+ years of demonstrated industry experience, with semiconductor packaging experience required.
• Experience with Design of Experiments and Statistical Process Control.
• Previous project management experience.
• Knowledge of material and package characterization data analysis, test methods, and qualification procedures.
• Strong understanding of wafer bump, fanout, assembly processes, and techniques.
• Experience with cost modeling, pricing, quoting activities, and products.
• Proven ability to multiplex across numerous programs and teams.
• Experience working with offshore factories is a plus.
• Demonstrated self-drive and motivation to adapt and overcome obstacles in a dynamic, fast-paced environment.
• Ability to work independently in a heavily matrixed organization.
• Excellent written and verbal communication skills.
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook).
• Up to 10% travel may be required.

Preferred Qualifications

• Flip Chip package design and OSAT experience.
• Experience working with external customers.

Schedule

This position has a hybrid schedule. Candidates must reside near the local Amkor office in Tempe, AZ, or be willing to relocate.